Microchip Technology Inc
Turnkey Solutions, Rugged Packaging with Improved Power Density
 
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Power Modules

Microchip’s highly integrated power module solutions simplify the power design process while offering exceptional performance. These modules feature a complete switching power supply solution in an ultra-compact, rugged, thermally enhanced package to improve high power density. Utilizing our proprietary Hyper Speed Control™ architecture, these modules are designed to offer fast load transients to minimize output capacitance. HyperLight Load® control provides efficiency improvements for light load operation.
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Ease of Use

  • Turnkey solution for fast time-to-market
  • Integrated controller, inductor, and MOSFETs
  • Easy layout and assembly

Performance

  • Up to 93% power conversion efficiency
  • Low radiated emissions (EMI)
  • Hyper Speed Control™ enables fast load transient response
  • HyperLight Load® improves light load efficiency

Small Form Factor

  • Small QFN package reduces solution size
  • Uses up to 60% less board space versus discrete designs
  • Low height profile (down to 0.9mm)

Robust

  • Rugged package design for thermal performance, vibration, and humidity resistance
  • Fewer external components improve reliability
  • Fully specified from -40°C to +125°C
Low Voltage
VIN = 2.7V To 5.5V
Medium Voltage
VIN = 4.5V To 26V
High Voltage
VIN = 4.5V To 50V
High Voltage
VIN = 4.5V To 70V
3A Heldo® Family
MIC38300 (4 × 6 × 0.9)
14A
MIC45212 (12 × 12× 4) 
3A
MIC28303 (12 × 12 × 3)
3A
MIC28304 (12 × 12 × 3) 
1.5A Heldo Family
MIC38150  (4 × 6 × 0.9)
10A
MIC45208 (10 × 10 × 4)
  
1.2A
MIC33153 (3 × 3 × 1.1)
6A
MIC45205 (8 × 8 × 3)
  
600 mA
MIC33050 (3 × 3 × 0.9)
MIC3385 (3 × 3.5 × 0.9)
6A
MIC45116 (8 × 8 × 3)
  
400 mA
MIC33030 (2.5 × 2 × 1.1)
5A
MIC45404 (10 × 6 × 2)