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DC-DC Power Modules - Power Supply ICs

As subsystem designs get more complicated and board space becomes more valuable, many designers are considering using power modules instead of traditional discrete DC-DC Point-of-Load (POL) designs to reduce board size, improve reliability and speed up time to market.

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Microchip’s highly integrated power modules contain a controller, power switches and the necessary passive components—all of which are fully tested and pre-characterized for EMI and DC performance—to offer a complete switching power supply solution. Offered in an ultra-compact, rugged and thermally enhanced package to improve high power density in your designs, these modules simplify your power design process while offering exceptional performance. Utilizing our proprietary Hyper Speed Control® architecture, they are designed to offer fast load transients to minimize output capacitance. Their HyperLight Load® mode provides efficiency improvements for light-load operation.

How Can a Power Module Solve Your Design Challenges?

  • Save board space and reduce PCB complexity
  • Thermal performance delivered in a small package
  • Pre-characterized EMI and DC Performance

Ease of Use

  • Turnkey solution speeds your time to market
  • Integrated controller, inductor and MOSFETs for simplified design
  • Optimized pinout for easy layout and assembly

Exceptional Performance

  • Up to 93% power conversion efficiency
  • Low radiated emissions (EMI)
  • Hyper Speed Control architecture enables fast load transient response
  • HyperLight Load mode improves light-load efficiency

Small Form Factor

  • Small QFN package reduces solution size
  • Uses up to 60% less board space versus discrete designs
  • Low height profile (down to 0.9 mm)

Robust

  • Rugged package design for thermal performance, vibration and humidity resistance
  • Fewer external components improve reliability
  • Fully specified from -40°C to +125°C
Design Versatility
+
  • Microchip’s power module portfolio covers input voltages ranging from 2.7V to 70V and current levels that range from 400 ma to 14A
  • They include integrated inductors and passive components targeted to automotive, industrial and server/computing applications
  • Special packaging techniques offer enhanced EMI/EMC performance over other industry solutions
The Microchip Difference
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Reducing Thermal Resistivity While Maintaining a Low Profile

Many industry solutions use die-in-PCB or die-over-PCB approaches. While these solutions make it easy to densely integrate the passive components, the plastics themselves are thermally resistive. Their poor thermal capabilities essentially negate their size advantage. The maximum operating temperature suffers and current capabilities get substantially de-rated over operating temperature. As a result, designers will require a larger, higher-current power module to meet the same application needs.

Microchip’s modules have superior thermal performance because they are built around thermally conductive copper lead frames instead of Printed Circuit Boards (PCBs). This allows operation up to the full-rated current, even at elevated temperatures, making the system more robust and more competitive in terms of both cost and size. The ultra-low profile combined with superior thermal performance enables the module to be placed under the PCB or on backplanes to save precious board space.


Power Module Families

Low Voltage
VIN = 2.7V to 5.5V
Medium Voltage
VIN = 4.5V to 26V
High Voltage
VIN = 4.5V to 50V
High Voltage
VIN = 4.5V to 70V
3A Heldo® Family
MIC38300 (4 × 6 × 0.9)
14A
MIC45212 (12 × 12× 4) 
3A
MIC28303 (12 × 12 × 3)
3A
MIC28304 (12 × 12 × 3) 
1.5A Heldo Family
MIC38150  (4 × 6 × 0.9)
10A
MIC45208 (10 × 10 × 4)
  
1.2A
MIC33153 (3 × 3 × 1.1)
6A
MIC45205 (8 × 8 × 3)
  
600 mA
MIC33050 (3 × 3 × 0.9)
MIC3385 (3 × 3.5 × 0.9)
6A
MIC45116 (8 × 8 × 3)
  
400 mA
MIC33030 (2.5 × 2 × 1.1)
5A
MIC45404 (10 × 6 × 2)
  

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