Solder-free press-fit terminal power modules allow for automated or robotic installation, which simplifies and speeds up the assembly process to reduce manufacturing costs. The high accuracy of the terminal locations and the novel press-fit pin design in our SP1F and SP3F power modules enables high-reliability contact with the printed circuit card. Overall, a press-fit power module solution can save valuable time and production costs.
There are over 200 variants available in our SP1F and SP3F power modules portfolio, with options to use mSiC™ technology or Si semiconductors and an array of topologies and ratings. The SP1F and SP3F are offered in a voltage range of 600–1700V and up to 280A.
Provides design suggestions for common circuit needs, estimates performance for common modifications, and can export to MPLAB® Mindi™ Analog Simulator for verification.
Uses a SIMetrix/SIMPLIS environment to model circuit behavior, reducing design time with software debugging for initial design verification.
Our complimentary MicroCHECK design review service, which offers insight from the initial concept to the final PCB layout, is available to customers who are using our products in their projects.