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Microchip Technology Inc. is committed to making innovative design easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio support customers throughout the design process, from concept to completion. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications and computing markets.
News
Elektrobit and Microchip Collaborate on Pre-Integrated AUTOSAR Solutions for Next-Generation Automotive Platforms
Collaboration combines Elektrobit’s AUTOSAR software and tooling with Microchip's automotive microprocessor platforms to help automotive OEMs and Tier 1 suppliers reduce integration effort, lower development risk and accelerate time to market
Microchip Expands Space Power Portfolio with New Radiation-Tolerant GaN Point-of-Load Converter
Power device delivers 20A of continuous current in a compact form factor for new space and traditional space applications
Microchip Expands Data Center Portfolio to Meet Evolving AI Infrastructure Demands
New connectivity, storage and acceleration solutions help address performance, security and scalability challenges across modern computing architectures
Large Scale Wireless Network Validation
Laboratory testing can verify functionality, but real-world deployments introduce challenges such as RF interference, physical barriers and increasing node density. Learn how a sector-based validation infrastructure helps engineers assess wireless network performance at scale before moving systems into production.
What Makes a USB SmartHub Different?
Connected embedded systems increasingly require more than basic USB expansion to support internal (chip-to-chip) interface requirements. USB SmartHub ICs combine high-speed hub functionality, interface bridging and flexible port management in a single device, helping developers reduce system complexity while supporting evolving automotive and industrial architectures.
Extending the Mission Envelope of High-Performance Plastic MCUs
The new SAMV71Q21RT extends the mission envelope of high-performance radiation-tolerant MCUs with 50 krad(Si) TID capability and an enhanced Plastic Class 1 quality grade equivalent to QML Class P. Built from the proven SAMV71 architecture, it gives space designers greater flexibility to balance radiation tolerance, quality, performance, packaging and program cost.
MU Live! Roadshow
Electronica 2026
CES 2027
This January at CES 2027, innovation takes center stage—and we are leading the way.