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Semiconductor Packaging and Assembly Services

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Leading-Edge Advanced Semiconductor Packaging Services


The Microchip Advanced Packaging Services site is located in Caldicot, South Wales, UK. With a history of innovating for more than 30 years, our team offers extensive knowledge and expertise to fully support cutting-edge projects and design innovative technology that will give you a competitive edge in your market.

We will work closely with you to meet your semiconductor packaging requirements, reduce your development and manufacturing costs, reduce risk and bring your product to market quickly.

Our Capabilities


Microelectronics Assembly Services

Microelectronics Assembly Services

Benefits for You

  • Scalable manufacturing process 
  • Rapid prototyping
  • Full supply chain management
Miniaturization Services

Microelectronic Miniaturization Services

Benefits for You

  • Significant size reduction 
  • Low cost of entry
  • Fast turnaround time 
Power Module

Complex Power Module Services

Benefits for You

  • High power density
  • High efficiency 
  • Module customization  
Man holding wafer

Large-Area Panel Molding Services

Benefits for You

  • Low cost of entry 
  • Flexible size and shape 
  • High reliability

Contact Us


Microchip Advanced Packaging Services
Phase 2, Castlegate Business Park, Unit 4, Caldicot
Monmouthshire, South Wales, UK
NP26 5YW

Email Address: Info-Caldicot@microchip.com
Phone Number: (+44) 01291 435351

Caldicot Microchip Advanced Packaging Services UK Location