New Products Q1 2026

Entry-Level Low-Power 5V Cortex^®-Mo+ Microcontrollers for Real-Time Control and Automotive HMI Applications

PIC32CM PL10 MCUs with feature rich set of Core Independent Peripherals (CIPs), 5V operation, touch capabilities, integrated toolsets and safety compliance.

Features:

• ISO 26262 ASIL B compliant
• 128/64/32KB Flash and 16/8/4KB SRAM
• 5V operation
• Peripheral Touch Controller (PTC) for robust low power touch
• 12-bit differential ADC
• Multi-Voltage I/O (MVIO)
• Pin compatible with 8-bit AVR^® and future PIC32CM Px families

Markets and applications:

• Industrial control
• Building automation
• Consumer appliances
• Automotive HMI
• Power tools
• Sensor-based systems
• Battery powered devices
• Companion MCU to larger MCUs/MPUs

See PIC32CM6408PL10028/32/48/64 Datasheet →

Precise Real-Time Control, Advanced Analog, Security with Post-Quantum Cryptography (PQC) Acceleration, Rich Peripherals in Low Pin Count (LPC)

High‑performance dsPIC^® CPU, advanced analog, resolver interface, I3C, high‑resolution Pulse Width Modulation (PWM), and hardware‑accelerated PQC hash.

Features:

• 200 MHz dsPIC33 CPU with DP‑FPU, delivering high‑precision real‑time control in low‑pin‑count devices
• Enables precise motor, power, and sensing control with built‑in application specific peripherals —reducing external components and system cost
• Integrated SHA‑3/SHAKE accelerator and PQC library support help meet emerging cybersecurity requirements
• ISO 26262‑ and IEC 61508 compliant with support for core power monitor and other hardware safety features

Markets and applications:

• Digital Power: Data center/server PSUs, EV OBC/DC‑DC, fast chargers, energy storage, solar inverters, smart grid
• Motor Control: Fans, pumps, compressors, actuators, HVAC, power tools, FOC, robotics, industrial automation
• Advanced Sensing: Automotive and industrial sensing, capacitive touch sensing, current, pressure, ultrasonic
• Audio/Lighting: Class-D audio, AVAS, industrial and automotive lighting

See dsPIC33AK256MPS306 Datasheet →

High-Performance Hybrid MCU for 2W/3W Clusters and Other Automotive-Related Displays

800 MHz ARM926-based CPU with 512 Mb integrated 200 MHz DDR2. The new SIPs integrate MIPI DSI and Low Voltage Differential Signal Controller (LVDS) display, dual CAN-FD and 10/100/1000 EMACs for transportation-related displays.

Features:

• MIPI DSI and LVDS
• 10/100/1000 EMAC
• Dual CAN-FD (x2) and SD or eMMC
• Secure boot, unique ID, True Random Number Generator (TRNG), Static Random-Access Memory (SRAM) Physically Unclonable Function (PUF), 11 KB One-Time-Programmable (OTP) for key storage
• Hardware Crypto Engine (AES, SHA, TDES, RSA and ECC) with 5 KB secure SRAM

Markets and applications:

• Graphics rich HMI: up to 1024 x 768 resolution, MIPI-DSI, LVDS, 2D
• Hardware accelerator, MIPI-CSI camera​
• Scalable platform: Bare metal/RTOS or Linux^® ​
• Connectivity with multiple wired or wireless interfaces​
• Low power applications​
• IoT, or any other “secured” application

See SAM9X75 SIP Datasheet →

High-Performance MPU SIP for Display, Audio and Connectivity Applications in Home/Building, Industrial, Appliance and Transportation Markets

1 GHz Cortex^® A7-based CPU with 512 Mb integrated 400 MHz DDR2. The new SIPs integrate MIPI DSI and LVDS display and dual 10/100/1000 EMACs and I3C host support for RTOS-based applications.

Features:

• MIPI DSI and LVDS
• Dual 10/100/1000 EMAC
• Five CAN-FD
• Audio sub-system including I2S, PDM, SPDIF and 8-channel Asynchronous Sample Rate Converter (ASRC)
• Secure Boot, Unique ID, TRNG, SRAM PUF, 11 KB OTP for key storage
• Hardware Crypto Engine (AES, SHA, TDES, RSA and ECC) with 5 KB secure SRAM

Markets and applications:

• Industrial, medical, home/building automation and transportation
• Connectivity with multiple wired or wireless interfaces
• Low power applications
• IoT, or any other “secured” application

See SAMA7D65 SIP Datasheet →

Lowest Priced Mid-Speed Delta Sigma ADCs

Single, dual and quad differential channel 9.6 ksps 24-bit Delta Sigma Converters.

Features:

• Faster, smaller and less expensive than the competition
• Pin-compatible with faster devices for easy transition
  • MCP3561R, MCP3562R, MCP3564R

Markets and applications:

• High-precision, multichannel data acquisition
• Medical and scientific instrumentation
• Precision sensing: Pressure, strain and force
• Current measurement
• Temperature measurement

View MCP3541R, MCP3542R and MCP3544R Product Pages →

Precision‑Grade ADC Performance with Practical Sampling Speeds and Ultra‑Low Power Efficiency

Our 250 ksps single-channel Successive Approximation Register (SAR) ADC series, 12-, 14- and 16-bit resolution, with fully differential and single-ended inputs, respectively; they feature high performance and low power consumption in a small package.

Features:

• High‑accuracy with ultra‑low power consumption (1 mW, 2.3 mW at 250 ksps)
• SPI-compatible serial communication (SCLK clock rate 100 MHz)
• ADC self-calibration for offset, gain and linearity errors
• Compact 10‑pin MSOP and TDFN packages, minimizing PCB area
• Recommended for automotive designs (AEC-Q100)

Markets and applications:

• High-precision data acquisition
• Medical instruments
• Test equipment
• Electric vehicle battery management systems
• Motor control applications
• Switch-mode power supply applications
• Battery-powered equipment

See MCP33151X/41X-025 and MCP33131D/MCP33131-025 Datasheet →

View MCP33131-025, MCP33141-025 and MCP33151-025 Product Pages →

SP7HPD (Hybrid Power Drive) Modules (20 kW to 80 kW): Perfect for Actuation Systems & DC/AC and AC/DC Power Generation (eVTOLs and Traditional Aerospace Applications)

Three devices are currently available in references in our standard portfolio.

Features:

• Six-pack configuration with shunt resistors
• Silicon carbide and silicon power semiconductor technologies
• Low-weight, low-profile and low-inductance package
• Thermal sensor
• Specific potting materials for extended-temperature applications down to -55°C
• Full aerospace custom versions (managed under AS9100 quality standards) available on demand
• Designed to support DO-160G aerospace design requirements
• Available with or without optional gate-driver companion board for integrated Hybrid Power Drive (HPD) solutions

Markets and applications:

• eVTOLs propulsion systems and outboard battery chargers
• Traditional aerospace applications, including braking and landing gear actuation systems and high-power DC/AC and AC/DC power generation

See MSCSMC120XM047CT7NMG, MSCGX150X120CT7NMG and APTGX150X120T7NMG Datasheet →

View MSCSMC120XM047CT7NMG, MSCGX150X120CT7NMG & APTGX150X120T7NMG Product Pages →

High-Density Power Module for AI Core and Edge Applications

High power density accelerates time-to-market while reducing solution cost, size and complexity.

Features:

• Input voltage range: 4.5V to 16V
• Adjustable output voltage: 0.6V to 1.8V
• Continuous 25A load capability
• Stackable up to 200A (8 modules)
• Plug and play: no external compensation required
• Small size: 6.8 x 7.65 x 3.85 mm

Markets and applications:

• Data center
• Storage
• Industrial
• Telecommunications and networking
• Distributed Point Of Load (POL)
• Computing peripherals

See MCPF1525M06 Datasheet →

16V, 35A Fully Integrated DC-DC Power Module

Fully integrated buck power module combining a Pulse-Width Modulation (PWM) controller, a MOSFET driver with power MOSFETs, an inductor and passive components.

Features:

• Wide input voltage range: 4.5V to 16V​​
• Resistor-programmable adjustable output from 0.6V to 1.8V
• 35A continuous output rating​
• Adjustable frequency from 300 kHz to 600 kHz​​
• 11 x 17 x 6.46 mm LGA Package

Markets and applications:

• Data center
• Storage
• Industrial
• Telecommunications and Networking
• Distributed Point of Load (POL)
• Computing peripherals

See MIC45M235 Datasheet →

Delivers an Optimal Balance of Performance, Reliability and Cost-Effectiveness

mSiC™ MOSFETs: 1200V MB 1200V 20mΩ–80mΩ TO-247-3 and TO-263-7 (D2PAK).

*Die and TO-247-4 Notch previously released and available

Features:

• Industrial and AEC-Q101-qualified options
  • Enables use across automotive and high-reliability industrial applications
• Optimized cost-performance ratio for scalable system designs
• Standard gate-drive compatibility (VGS > 15V)
  • Helps simplify adoption with existing gate-drive designs
• Low switching energy
  • Supports higher switching frequencies and improved efficiency
• RDS(on) stability across temperature
  • Supports more predictable performance and simplified thermal design
• Industry-standard package options
  • TO-247-3 package supporting second-source migration
  • TO-263-7 (D2PAK-7) package with Kelvin source pin for improved switching performance, reduced parasitics and enhanced gate control

Markets and applications:

• Electric vehicles
• Industrial
• Renewables/grid
• Medical
• Aerospace and defense

See All Products Datasheet →

Compact Automotive maXTouch BGA Package for Space Constrained Applications

Superior touch performance providing 36 touch channels in an automotive-qualified BGA package supporting OLED, uLED and LCD display technologies.

Features:

• Ultra compact BGA60 package
  • 8 mm x 5 mm x 1 mm with 0.8 mm ball pitch
• Designed to support ISO26262 ASIL-B functional safety and Design Assurance Level (DAL) applications
• Firmware authentication support using SHA-512
• Smart mutual acquisition scheme for greater Signal-to-Noise (SNR) ratio
• Single PWM output with shape event trigger for low-latency haptic feedback
• Knob-on-display support for up to four instances
• Up to 105C operating temperature
• Operating system (OS) driver support for Linux^®, Android™, Windows^®, AliOS, Automotive QNXT^™ and Zephyr^®

Markets and applications:

• Automotive: HVAC and door panel displays, virtual assistants
• Industrial: control panels, agricultural equipment and off-road vehicles
• Medical: display and touch surface applications
• Avionic cockpits and in-flight entertainment

See ATMXT288M1 Datasheet →

Automotive-Grade 2-Chip maXTouch Solution for Very Large Displays up to 45 in.

Up to 224 touch channels without additional MCU to support very large touchscreens across display technologies, including OLED, uLED and LCD.

Features:

• Designed to support ISO26262 ASIL-B functional safety and DAL applications
• Firmware authentication support using SHA-512
• Smart mutual acquisition scheme for greater SNR
• Single PWM output with shape event trigger for low-latency haptic feedback
• Up to 105C operating temperature
• OS driver support for Linux^®, Android™, Windows^®, AliOS, Automotive QNXT™ and Zephyr^®

Markets and applications:

• Automotive: Central and Passenger Information (CID/PID) displays
• Industrial: control panels, kiosks, gas pumps, EV chargers and information and education panels
• Avionic cockpits and in-flight entertainment

See ATMXT3072M1HC Datasheet →