We offer a variety of customized services for special types of applications or specific products. Please use these links to learn more about each service:
Custom integrated circuit design of analog mixed-signal solutions for aerospace, avionics, defense, industrial and automotive companies
Multiple services that support the FPGA and SoC design flow including initial design services, first article, prototyping and volume programming
Manufacturing of custom projects on 150 or 200 mm wafer diameters at one of our three IATF-16949 certified wafer fabs located in the United States
Custom design and manufacturing of modules and hybrids for aerospace, defense, space and industrial applications
Large Area Panel (LAP)-based embedded die technology to perform sub-system size reduction levels that cannot be achieved via standard chip-on-board technology
Quick, secure and inexpensive production programming of our microcontrollers and memory devices through our online interface
Experience with military high-efficiency switchers and inherent radiation-hard topologies plus conservative mechanical design
Specialized services to help with planning, deployment and maintenance of your synchronization infrastructure