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Customized Services for Your Application
We offer a variety of customized services for special types of applications or specific products. Please use these links to learn more about each service.
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ASIC Design Services
We offer custom integrated circuit design of analog mixed-signal solutions for aerospace, avionics, defense, industrial and automotive companies.
We can help you manufacture custom projects on 150 or 200 mm wafer diameters at one of our three IATF-16949 certified wafer fabs located in the United States.
Meet your Size, Weight and Power (SWaP) requirements with our wafer probe, wafer sawing, die attach, wire bonding, flip chip, encapsulation, surface mount assembly, test, CAD and embedding services.
Our embedded System-In-Package (SiP) technology provides unparalleled miniaturization in a proven and robust package capable of meeting the most stringent quality requirements.
Our Si IGBT and SiC MOSFET technologies significantly improve power density. We offer heavy-gauge wire bonding, silicon potting, film-assisted molding, silver sintering and tab welding services