New Products Q4 2025

High-Performance MPU SIP for Display, Audio and Connectivity Applications

1 GHz Cortex^® A7 based CPU with 4 Gb integrated 533 MHz Double Data Rate 3 Low Voltage (DDR3L) memory. The new SIPs integrate MIPI DSI, LVDS display support, 10/100/1000 Ethernet Media Access Controllers (EMACs) and Improved Inter-Integrated Circuit (I3C) host support.

Features:

• MIPI DSI and LVDS display support
• Dual 10/100/1000 EMAC
• Five Controller Area Network Flexible Data-Rate (CAN-FD) interfaces
• Audio sub-system including Inter-IC Sound (I2S), Pulse Density Modulation (PDM), Sony/Phillips Digital Interface (SPDIF) and 8-channel Asynchronous SampleRate Converter (ASRC) support.
• Secure Boot, unique ID, True Random Number Generator (TRNG), Static Random-Access Memory (SRAM) Physical Unclonable Function (PUF) and 11 KB One-Time Programmable (OTP) memory for key storage
• Hardware cryptography engine supporting Advanced Encryption Standard (AES), Secure Hash Algorithm (SHA), Triple Data Encryption Standard (TDES), Rivest-Shamir-Adleman (RSA) and Elliptic Curve Cryptography (ECC) with 5 KB secure SRAM

Applications:

• Industrial, medical, home and building automation and transportation applications
• Connectivity with multiple wired and wireless interfaces
• Low power applications
• IoT and other security-focused applications

See Product Datasheet →

Compact MPU SoC Packaging for Space Constrained and More Cost-Sensitive Projects (Up to 59% smaller package)

Small, 9 mm x 9 mm 0.5 mm pitch Ball Grid Array (BGA)289 packaging for ultra-low-cost, low-power Linux^® OR high-end bare-metal/Real-Time Operating System (RTOS) projects.

Features:

• 500 MHz Cortex^® A5 (~ 785 DMIPS)
• 24-bit parallel Red Green Blue (RGB) display support
• Single 10/100 Ethernet MAC
• Two CAN 2.0 interfaces
• Secure Boot, unique ID, TRNG, SRAM PUF, 11 KB OTP for key storage
• Hardware cryptography engine supporting AES, SHA and TDES

Markets and applications:

• Graphics rich Human-Machine Interface (HMI) applications supporting up to 1024 x 768 RGB resolution
• Scalable platform supporting bare metal, RTOS or Linux environments
• Connectivity with multiple wired/wireless interfaces
• Low power applications
• IoT or any other “Secured” application

See Product Datasheet →

Smaller MPU SOC Packaging for Space Constrained and More Cost-Sensitive Projects (Up to 59% smaller package)

Small, 9 mm x 9 mm 0.4 mm pitch BGA375 packaging for ultra low-cost, low-power Linux OR high-end bare-metal/RTOS projects.

Features:

• MIPI-DSI, LVDS or MIPI- Camera Serial Interface (CSI) support
• Dual 10/100/1000 EMAC support or combined 10/100 and 10/100/1000 Ethernet configurations
• Up to six CAN-FD interfaces
• Audio sub-system including I2S, PDM, SPDIF and 8ch ASRC
• Arm^® TrustZone^®, secure boot, hardware cryptography and OTP Key storage

Markets and applications:

• Industrial, medical, home/building automation and transportation
• Connectivity with multiple wired/wireless interfaces
• Low power applications
• IoT or any other “Secured” application

See SAMA7D65 and SAMA7G54 Datasheet →  

View SAMA7D65 and SAMA7G54 Products →

Low-Power Digital Power Monitors With Enhanced System Insight

42V 12-bit and 16-bit digital power monitors with individual limit registers for under/over current, under/over voltage, overpower and accumulation limit.

Features:

• Low quiescent current
  • 100 µA (12-bit) at 1024 samples per second (SPS)
  • 140 µA (16-bit) at 1024 SPS
• Power consumption scales with sample rate, reaching 7 µA at 8 SPS)
• On-chip accumulation of 24-bit results
• High-side or low-side power monitoring
• AEC-Q100 qualified
• 1% power measurement accuracy across a wide dynamic range
• I2C™ up to 3.4 MHz

Markets and applications:

• Data center and computing
• Automotive
• Smart home and smart city applications
• Networking
• Internet of Things (IoT)
• Battery-powered applications
• Low-current general-purpose applications

See PAC1711 and PAC1811 Datasheet →  

View PAC1711 and PAC1811 Products →

Precision Shunt-Based Current Measurement for Automotive Systems, AEC-Q100 Grade 1 Qualified

Featuring preset gains, wide input and supply ranges and zero-drift architecture, the MCP6C26 enables accurate, low-power current measurement for automotive and industrial applications from 40°C to 125°C.

Features:

• Ultra-low offset and high-precision: VOS ±15 µV (typical)
• Input common-mode voltages: –0.2V to 36V (specified)
• Three preset gain options: 50, 100 and 200 V/V
• Power supply: 2.7V to 5.5V
• Gain-bandwidth product: 9 MHz (typical) at gain = 100 V/V
• Supports bidirectional or unidirectional current measurement

Markets and applications:

• Motor control current sensing
• Robotics and electric vehicle applications
• DC/DC converters
• Battery management systems
• USB power delivery
• Uninterruptible power supplies
• Differential sensor conditioning

See MCP6C26 Datasheet →

SmartFusion^® 2 SoC Enables Semtech to Deliver USB Extension

SmartFusion^® 2 enables deterministic, secure, driver-free USB extension for professional AV, industrial automation and medical systems by addressing USB protocol timing limitations.

Features:

• Semtech UEX2000 is based on the SmartFusion 2 SoC
• Semtech UEX2000 platforms incorporate SmartFusion2 devices
• UEX2000 extends USB over Ethernet through protocol timing management rather than signal amplification or device proxying
• UEX2000 benefits from SmartFusion 2 deterministic performance, hardware-enforced control and security, driver-free operation and long-lifecycle reliability
• Demonstrates how developers can leverage Microchip FPGAs and SoCs to develop scalable solutions for professional AV, industrial and medical applications.

Markets and applications:

• Professional audio and visual systems
• Industrial factory floor device control
• Medical operating rooms and imaging systems

See SmartFusion 2 SoC FPGA and Semtech UEX1000/UEX2000 USB Extender Datasheet →  

View SmartFusion^® 2 FPGAs and Semtech UEX2000 Products →

High-Speed, Long-Reach Real-Time Imaging from SLVS-EC to CoaXPress With PolarFire^® FPGAs

A high-performance SLVS-EC to CoaXPress bridge supporting 8×5 Gb/s SLVS-EC inputs and 4×12.5 Gb/s CXP outputs, delivering up to 50 Gb/s aggregate bandwidth with deterministic, low-latency FPGA-based processing.

Features:

• High-speed interfaces supporting CoaXPress and SLVS-EC for low-latency data transfer
• Imaging performance supporting up to 4K at 60 fps
• System Integration with GenICam control and FPGA integration
• In-house IP with native SLVS-EC 2.0 and CoaXPress support

Markets and applications:

• Machine vision and industrial inspection
• Medical imaging systems
• Robotics and automation
• Scientific and high-speed imaging

View CoaXPress IP and PolarFire SLVS-EC Receiver IP User Guide →

See AN6143: SLVS to CoaXPress Demo Application Note →

A Fully Integrated 1G TSN Endpoint Solution Delivering Deterministic, Low-Latency, Time-Synchronized Ethernet Communication on PolarFire^® FPGAs

Our TSN endpoint solution integrates TSN hardware, Linux-based software, soft IP, and OPC UA over TSN on PolarFire SoC FPGAs.

Features:

Compliant with the IEC/IEEE 60802 TSN profile for industrial automation

• 1 Gbps TSN standalone Ethernet endpoint
• Time-aware scheduler supporting IEEE 802.1Qbv
• Precision Time Protocol (PTP) support for IEEE 802.1 1588 and IEEE 802.1AS
• Frame preemption support for IEEE 802.1Qbu
• Per-stream filtering and policing support for IEEE 802.1Qci
• Linux drivers for TSN and IEEE 1588

Markets and applications:

• Industrial Automation & Factory Control
• Robotics & Motion Control
• Aerospace & Defense

See PolarFire SoC TSN Application Note and Core TSN IP Guide →

Drive Compact Isolated Power Supplies With Flexibile Small- Form-Factor Designs

The MCP14T0517 is a push-pull transformer driver designed for small-form-factor isolated power supplies with a typical input voltage range from 3V to 5.5V DC.

Features:

• Two Switching Frequency Options:150 kHz (MCP14T0517A) or 450 kHz (MCP14T0517B) to balance space savings and Electromagnetic Interference (EMI) reduction
• Integrated overcurrent, overtemperature and Undervoltage Lockout (UVLO) protection with Grade 1 AEC-Q100 qualification
• External clock input for synchronizations with multiple devices and enable function

Markets and applications:

• Isolated power supplies for Silicon Carbide (SiC)/Silicon (Si) MOSFETs and IGBTs
• Bias generators for isolated communication Interfaces including CAN, LIN and USB
• Bias generators for isolated sensing circuitry

See MCP14T0517 Datasheet →

600V MOSFET and IGBT Drivers Supporting Commercial and Industrial Applications

High-voltage, high-speed gate driver designed to drive N-channel MOSFETs and IGBTs in a high-side/low-side configuration. The MCP14LH2101 supports high-side switching up to 600V in a bootstrap operation.

Features:

• Floating high-side driver in bootstrap operation up to 600V
• Drives two N-channel MOSFETs or IGBTs in a high-side/low-side configuration
• Outputs tolerant to negative transients
• Drive current IO+/IO- = 290 mA/600 mA typical
• Wide low-side gate driver and logic supply range: 10V to 20V
• CMOS and TTL-compatible logic inputs down to 3.3V
• Schmitt-triggered logic inputs with internal pull- down
• Undervoltage lockout for VCC

Markets and applications:

Industrial power management and motor control 

• DC-DC converters
• AC-DC inverters for solar and green energy applications
• Motor control applications including Brushless DC (BLDC), stepper, servo and brushed DC motors

Class D power amplifiers

See MCP14LH210 Datasheet →

600V MOSFET & IGBT Drivers Supporting Commercial & Industrial Applications

High-voltage, high-speed gate driver capable of driving N-channel MOSFETs and IGBTs in a half-bridge configuration. MCP14H2184M high-side switches to 600V in a bootstrap operation.

Features:

• Floating high-side driver in bootstrap operation up to 600V
• Drives two N-Channel MOSFETs or IGBTs in a half-bridge configuration
• 1.4A source/1.8A sink output current capability
• Outputs tolerant to negative transients
• Internal 400 ns deadtime to help protect MOSFETs
• Wide low-side gate driver supply voltage range: 10V to 20V
• 3.3V-compatible logic inputs (IN and SD*)
• Schmitt-triggered logic inputs with internal pull- down
• Undervoltage lockout for high-side and low-side Ddrivers
• Extended temperature range from 40°C to 125°C

Markets and applications:

Industrial power management and motor control 

• DC-DC converters
• AC-DC inverters for solar and green energy applications
• Motor control applications including BLDC, stepper, servo and brushed DC motors
• Class D power amplifiers

See MCP14H2184 Datasheet →

600V Half-Bridge Gate Drivers With Internal Deadtime, LIN* and SD* Options

The MCP14H2103 and MCP14H2104 are high-voltage, high-speed gate drivers designed to drive N-channel MOSFETs and IGBTs in a half-bridge configuration.

Features:

• Floating high-side driver in bootstrap operation up to 600V
• Drives two N-Channel MOSFETs or IGBTs in a half-bridge configuration
• Designed for noisy motor applications
• 290 mA cource/600 mA sink output current capability
• Outputs tolerant to negative transients
• Internal deadtime of 420 ns to help protect MOSFETs
• Wide low-side gate driver supply voltage: range 10V to 20V
• 3.3V-compatible logic inputs (HIN and LIN*) for the MCP14H2103
• 3.3V-compatible logic inputs (HIN and LIN*) for the MCP14H2104
• Schmitt-triggered logic inputs

Markets and applications:

Industrial power management and motor control 

• DC-DC Converters
• AC-DC Inverters for solar and green energy applications
• Motor control applications including BLDC, stepper, servo and brushed DC motors
• Class D Power Amplifiers

See MCP14H2103/4 Datasheet →

Enables Real-Time Monitoring and Control of Multiple Devices within a Bluetooth^® LE Star Network

Connect Multiple Devices within a Bluetooth^® LE Star Network.

Features:

• Simultaneous multi-device management supporting up to eight Bluetooth LE connections
• Automatic role switching between Central and Peripheral modes for dynamic network operation
• Continuous scanning and connection to available Bluetooth LE devices
• Smartphone connectivity and monitoring support
• Broad compatibility with Bluetooth LE sensors,
• Bluetooth LE Universal Asynchronous Receiver Transmitter (UART) devices and Arduino-based modules

Markets and applications:

• Smart buildings and facilities
• Smart home applications
• Industrial monitoring
• Asset tracking

Microchip Components:

• WBZ451PE
• RNBD451PE

Enables Wireless, Low-Power Data Display for IoT Devices

Reference Design Connecting a Low-Power Display to a Wireless MCU.

Features:

• Simplifies integration of Bluetooth LE connectivity with e-paper displays to help reduce development time
• +20 dBm transmit output power of the WBZ451HPE extends Bluetooth LE range and supports connectivity in noisy or interference-prone environments
• Supports flexible content updates through a mobile application

Markets and applications:

• Smart warehouse applications
• Smart home applications
• Asset tracking and retail
• Portable medical devices

Microchip Components:

• WBZ451PE