Packaging Services Collaborative Partners
Our Advanced Packaging Services Collaborative Partners
As a leading technology company, we have a deep interest in designing solutions for future innovations. We partner with electronics manufacturers, universities, research institutes and other organizations to identify trends and develop with new technologies. These collaborative projects increase our technical knowledge and create a network of expertise that adds value for our clients.
Our research and development projects are funded by a variety of organizations and through grants from the European Union and the Welsh and United Kingdom governments. They not only benefit our clients, but they also contribute to the economic development and increase employment opportunities in South Wales where we are located.
Since 2002 we have participated in over 30 projects. This page highlights some of our current collaborations. Contact us for more information about collaborations.
Featured Collaborations
CSconnected (Electric Vehicles)
CSconnected is a £43 million R&D project that aims to make semiconductor technology excel in Wales. Developments include:
- Electric vehicles and roadside charging
- Optical communications and sensing systems
- Atomic clocks and atomic magnetometers
- 5G technology
ASIT (Electric Vehicles)
ASIT is a collaboration supporting the development of zero-emission powertrains. The £1 million project has the end goal of developing a game-changing power module for the automotive industry that has:
- A high switching speed
- Signficantly reduced size, power loss and weight
ESCAPE (Electric Vehicles)
ESCAPE focuses on the supply chain for Silicon Carbide-based power modules to be used in:
- Zero-carbon Electric Vehicles (EVs)
- High-power EV charging points
An increase in manufacturing capabilities will support the UK in joining the global effort to move away from fossil fuels to green energy solutions.
ZeroAMP (Internet of Things, Machine Learning)
There is an increasing need for technologies to operate in situations where current transistors cannot perform efficiently. ZeroAMP aims to create an FPGA with:
- The ability to withstand harsh conditions such as high radiation, extreme temperatures (up to 300°C and long sleep periods) using NEMs technology
- Zero electric current leakage
- Zero standby power
InSiDe (Internet of Things)
InSiDe is a five-year project that is funded by the European Union's research and innovation program. The goal of this project is to develop a cardiovascular screening device that can spot and monitor early-stage cardiovascular disease.
MAGV (Internet of Things)
MAGV aims to create the world's first RF atomic magnetometer probe head to be used in non-destructive testing equipment. There are many benefits to using quantum magnetometers including:
- High sensitivity
- Simplicity
- Low-power operation
ExCellLight (Internet of Things)
ExCellLight will develop a small solar panel that can provide higher power than conventional solar panel technologies for use in:
- Indoor light harvesting (LED, florescent, solar)
- CubeSats and small satellites
- Smart farming
- New authentication capabilities for smart debit cards
CITCOM (Internet of Things, Machine Learning)
CITCOM focuses on optimizing and enhancing a variety of speciality applications including:
- Smart factories
- Plenoptic cameras
- X-ray systems
- Sub-micron image resolutions
- Automatic detection of buried defects otherwise invisible to optical systems
Contact Us
Microchip Advanced Packaging Services
Phase 2, Castlegate Business Park, Unit 4, Caldicot
Monmouthshire, South Wales, UK
NP26 5YW
Email Address: Info-Caldicot@microchip.com
Phone Number: (+44) 01291 435351
