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DC/DC Low-Voltage Power Modules (Input Voltage < 70V)

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DC/DC Power Modules—Input Voltages from 5.5V to 70V

Our highly integrated power modules contain a controller, power switches and the necessary passive components—all of which are fully tested and pre-characterized for EMI and DC performance—to offer a complete switching power supply solution. Available in an ultra-compact, rugged and thermally enhanced package to improve high power density in your designs, these modules simplify your power design process while offering exceptional performance. Utilizing our proprietary Hyper Speed Control® architecture, they are designed to offer fast load transients to minimize output capacitance. Their HyperLight Load® mode provides efficiency improvements for light-load operation. We also offer a power module that can be used to optimize the performance of your FPGA-based design.

Featured Power Module ICs

MCPF1412

High-Performance, High-Density Power Module

  • 16V supply, 12A load capability
  • Small LGA package 5.8 × 4.9 × 1.6 mm
  • Low conducted and radiated noise
  • Operating temperature range of −40°C to +125°C
  • Programmable using I2C and PMBus®

MIC33M350

3A, Pin-Strapping Power Module

  • 5.5V supply, 3A load capability
  • 3.0 × 4.5 × 1.8 mm QFN
  • AEC-Q qualified
  • 1.5% VOUT accuracy
  • HyperLight Load® mode for improved efficiency
  • Meets CISPR 32 for EMC emission standard for Multimedia Equipment (MME)

MIC28303

High-Voltage High-Current Power Module

  • 50V supply, 3A load capability
  • 12 × 12 × 3 mm QFN
  • 1% VOUT accuracy
  • HyperLight Load® mode for improved efficiency and Hyper Speed Control® architecture for ultra-fast transient response
  • Meets Low Radiated Emission (EMI) per EN55022, Class B

Features and Benefits

Ease of Use

  • Turnkey solution speeds your time to market
  • Integrated controller, inductor and MOSFETs for simplified design
  • Optimized pinout for easy layout and assembly

Exceptional Performance

  • Up to 93% power conversion efficiency
  • Low radiated emissions (EMI)
  • Hyper Speed Control architecture fast load transient response

Small Form Factor

  • Small QFN package reduces solution size
  • Uses up to 60% less board space versus discrete designs
  • Low height profile (down to 0.9 mm)

Robust

  • Rugged package design for thermal performance, vibration and humidity resistance
  • Fewer external components improve reliability
  • Fully specified from −40°C to +125°C

Low-Voltage Power Modules (Input Voltages <70V)

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Intel® Enpirion® Replacement Parts Selection

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Design Resources

MPLAB® Analog Designer

Provides design suggestions for common circuit needs, estimates performance for common modifications, and can export to MPLAB® Mindi™ Analog Simulator for verification.

MPLAB Mindi™ Analog Simulator

Uses a SIMetrix/SIMPLIS environment to model circuit behavior, reducing design time with software debugging for initial design verification.

MicroCHECK Design Service

Our complimentary MicroCHECK design review service, which offers insight from the initial concept to the final PCB layout, is available to customers who are using our products in their projects.