This Hybrid Power Device (HPD) is a complete solution that offers excellent performance, reliability and reduced weight. This module comes with an AlSiC baseplate with maximum dimensions of 108 mm × 67 mm × 25 mm.
High-performance SiC technology allows for higher power density, which means more power can be handled in a smaller footprint. SiC technology also significantly reduces switching losses, enhancing overall system efficiency and enabling faster switching speeds.
Stability is crucial for maintaining consistent performance in demanding environments. The ability to operate reliably at high temperatures without performance degradation extends the lifespan of the devices and reduces the need for additional cooling mechanisms.
Environmentally friendly and mechanically robust packaging ensures that the SiC devices can withstand harsh environmental conditions, including mechanical shocks and vibrations.
Solderable terminals simplify the process of mounting onto printed circuit boards (PCBs). This feature reduces assembly time and costs, making it easier for manufacturers to integrate these high-performance components into their designs. The solderable terminals also ensure a secure and reliable electrical connection, which is critical for maintaining the integrity of the overall system.
High thermal conductivity and low junction-to-case thermal resistance allow for efficient heat dissipation. The ability to directly mount these devices to a heatsink further enhances their thermal management capabilities. This reduces the need for extensive cooling systems, lowering overall system costs and improving reliability.
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