Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes
product primary image

WP441W6A1-500-NFEI

WP4

WinPath4 Network Processors

Status: In Production

Features:

  • More than 4x performance, higher integration than 3rd-generation WinPath3
  • Support both cut-through mode (data buffers in internal memory) or external switching mode (large number of data buffers in external DDR memory) for packet forwarding
  • Up to 48 RISC processors and 320 concurrent hardware threads processing at up to 500 MHz
  • 8.5 MB internal memory
  • Interlaken Look-Aside for external TCAM functionality
View More
Overview
Documents
Development Environment
RoHS Information
Add to Cart

Device Overview

Summary

The WinPath4 continues the carrier-grade Ethernet focus of its predecessors as the fourth generation of WinPath® products. Next generation protocols have been added along with a new level of performance, all the while supporting legacy applications and continuing Microchip's proven formula as a complete networking solution.

The WinPath4 integrates control plane and enhanced data plane processing components. Control plane processing is based on two high-performance MIPS 34K multi-threaded processors. Data plane processing uses dedicated hardware accelerators for packet classification, hierarchical shaping, additional security standards and more to off-load common processing tasks. The accelerators are flexibly combined with a field-proven, fully-programmable, high-performance multi-threaded multi-core data path processor subsystem. 48 cores are available (up from 12 in the WinPath3) and operating speed has increased.
The WinPath4 leverages a broad set of supplied protocols developed over the years and hardened in production environments all over the world. These include support for interworking (MPLS, IPv4/IPv6 Routing, VLAN-aware bridging), QoS (policing, shaping, per-flow queuing, WRED), Packet Network Synchronization (IEEE 1588v2, Synchronous Ethernet, adaptive and differential clock recovery), OAM (Ethernet, MPLS, ATM), L2 and L3 termination (Ethernet, ML-PPP, IMA, CES), PWE3 (Ethernet, TDM, HDLC, ATM) and more.

Additional Features
  • More than 4x performance, higher integration than 3rd-generation WinPath3
  • Support both cut-through mode (data buffers in internal memory) or external switching mode (large number of data buffers in external DDR memory) for packet forwarding
  • Up to 48 RISC processors and 320 concurrent hardware threads processing at up to 500 MHz
  • 8.5 MB internal memory
  • Interlaken Look-Aside for external TCAM functionality
  • 24 x GbE (SGMII or QSGMII) and 4 x 10GbE MACs
  • 27 multi-standard SERDES lanes shared among all interfaces
  • 40mm x 40mm 1517 FCBGA with 1mm ball pitch

Documents

Jump to:

Supporting Collateral


Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
WP441W6A1-400-NFEI
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
WP441W6A1-500-NFEI
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
T441EFEI-400A1
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
T441EFEI-500A1
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
T441NFEI-400A1
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
T441NFEI-500A1
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
WP441R6A1-500-EFEI
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
WP441R6A1-500-NFEI
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
WP441W6A1-500-EFEI
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
WP441W6A1-400-EFEI
0.000000
0.000000
1503
HBBGA
40x40x3.23mm
SAC305
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

Buy from Microchip

Grid
View
Table
View
Filter:
Apply
Clear
Only show products with samples
Product
Leads
Package Type
Temp Range
Packing Media
5K Pricing
Buy