• Higher power density to maximize the use of physical space within the data center
• Power supplies designed to handle high power loads without occupying excessive space
• Innovative packaging techniques

• Efficient power conversion for reducing energy losses
• Reduced waste heat because of efficient power conversion
• Reduced requirement for extensive cooling

• EMI can interfere with the operation of sensitive electronic equipment
• Servers and networking equipment are susceptible to EMI, which can impact their reliability and efficiency
• Power supplies, especially switch-mode power supplies (SMPS), operate by rapidly switching on and off. This switching action generates high-frequency transients that can radiate EMI

Power Density:

• Integrates high-side and low-side MOSFETs, which reduces the need for external components
• Thermally efficient package, such as the 3 × 3 mm DFN package
• Requires smaller inductors and capacitors

Efficiency:

• Synchronous four-switch buck/boost architecture
• Integrated MOSFET drivers and linear regulators
• Replaces the traditional diode with a low-resistance MOSFET
• Thermal management features, including thermal shutdown protection
• Low quiescent current

EMI/EMC:

• Fixed switching frequency, which helps in predicting and managing the EMI spectrum
• Optimized layout and pin configuration
• Easy addition of external filters and shielding if necessary

Power Density:

• Optimized circuit performance and reduction of total solution size versus discrete power designs
• Continuous 12A load capability
• 40% reduction in circuit design footprint

Efficiency:

• No external compensation required
• Programmable operation using I²C and PMBus™

EMI/EMC:

• Low differential mode impedance
• High common mode impedance
• Common mode noise suppression
• Low DC Resistance (DCR)
• Wide frequency range

Power Density:

• Integrates 13 power channels distributed as eight parallelable 1.5A buck regulators, four 300 mA LDOs and one low-input/low-output voltage LDO controller using an external MOSFET
• Optimized circuit performance and reduction of total solution size versus discrete power designs

Efficiency:

• Synchronous rectification
• High switching frequency (2 MHz)
• Low quiescent current
• 100% duty cycle capability of buck channels

EMI/EMC:

• Fixed-frequency operation
• Soft-start feature
• Low output ripple
• Optimized PCB layout guidance

Power Density:

• Integrates high-side and low-side MOSFETs, which reduces the need for external components
• Reducing the overall size of the power supply solution

Efficiency:

• Advanced control features such as programmable current limit, soft-start and frequency synchronization
• Synchronous rectification to the traditional diode with a low-resistance MOSFET
• Low quiescent current

EMI/EMC:

• Spread spectrum modulation, which dithers the switching frequency slightly
• Features a programmable soft-start to control the in-rush current and reduce EMI during startup

Power Density:

• Integrated FETs and gate drivers
• Compact package size for space-constrained applications

Efficiency:

• Advanced control features such as adaptive on-time control, which improves transient response and stability
• Synchronous rectification to the traditional diode with a low-resistance MOSFET

EMI/EMC:

• Thermal shutdown protection
• Spread spectrum modulation, which dithers the switching frequency slightly

Learn More About:

• MIC24066 and MIC24067

Power Density:

• Integrates high-side and low-side MOSFETs, which reduces the need for external components
• Includes optimized layout and thermal pad connections

Efficiency:

• Low-Dropout (LDO) voltage
• High Power Supply Rejection Ratio (PSRR)
• Accurate voltage regulation to optimize the performance of the load and reduce power wastage

EMI/EMC:

• Low noise output to minimize EMI
• Integrated bypass capacitors
• Thermal shutdown and current limit protection

Power Density:

• Integrated FET switching regulator that supports a 20A load
• Wide-input voltage range of 4.5V to 20V (optimized for 12V bus)
• Output voltage is adjustable down to 0.6V with ±0.5% accuracy
• Compact size: 6 mm × 7 mm
• 39-pin QFN package

Efficiency:

• High-voltage internal LDO for single supply operation
• Thermal shut down with hysteresis
• Output sense for tight voltage regulation
• Hyper Speed Control architecture with ultra-fast transient response for reduced output capacitance

EMI/EMC:

• Ripple injection from the SWnode to derive the necessary ripple required for controller operation

Power Density:

• Comes in a small, thermally enhanced package
• Wide-input voltage range from 4.5V to 100V
• Adjustable output, 0.6V to Dmax*VIN
• Built-in 5.4V/7.5V/10.5V selectable LDOs

Efficiency:

• ±1% Internal Reference Accuracy from -40°C to +125°C
• Selectable light load operation feature allows the user to select either Continuous Conduction Mode (CCM) or HyperLight Load (HLL) mode

EMI/EMC:

• 100 kHz to 800 kHz Adjustable Switching Frequency
•  Adjustable soft start time
• Optimized PCB layout recommendations

Power Density:

• Requires smaller inductors and capacitors
• Includes integrated MOSFET drivers 

Efficiency:

• Synchronous rectification that improves efficiency by reducing power losses associated with diode rectification
• Less heat generation and potentially smaller heat dissipation components 

EMI/EMC:

• Reduced peak electromagnetic emissions by spreading the energy over a wider frequency band
• Optimized layout and filtering
• Controlled switching characteristics, including adjustable switching frequency and soft-start functionality

Power Density:

• Comes in a small, thermally enhanced package
• Includes high-side and low-side MOSFETs, which reduces the need for external components
• Requires smaller inductors and capacitors

Efficiency:

• Low quiescent current
• Integrated power MOSFETs
• Advanced control techniques
• Battery-powered applications where extending battery life is crucial
• Optimized layout and packaging to dissipate heat effectively

EMI/EMC:

• Built-in EMI filters that help suppress high-frequency noise 
• Controlled rise and fall times
• Low output capacitance
• Optimized PCB layout recommendations

Power Density:

• Comes in a small, thermally enhanced package
• Includes high-side and low-side MOSFETs, which reduces the need for external components
• Requires smaller inductors and capacitors

Efficiency:

• Low quiescent current
• Integrated power MOSFETs
• Advanced control techniques
• Battery-powered applications where extending battery life is crucial
• Optimized layout and packaging to dissipate heat effectively

EMI/EMC:

• Built-in EMI filters that help suppress high-frequency noise 
• Controlled rise and fall times
• Low output capacitance
• Optimized PCB layout recommendations