Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes
product primary image

SY89824L

Status: In Production

Features:

  • 3.3V core supply, 1.8V output supply for reduced power
  • LVPECL and HSTL inputs
  • 22 differential HSTL (low-voltage swing) output pairs
  • HSTL outputs drive 50Ω to ground with no offset voltage
  • Low part-to-part skew (200ps max.)
  • Low pin-to-pin skew (50ps max.)
  • Available in a 64-Pin EPAD-TQFP
View More
Overview
Documents
Development Environment
RoHS Information
Add To Cart

Device Overview

Summary

The SY89824L is a High Performance Bus Clock Driver with 22 differential HSTL (High Speed Transceiver Logic) output pairs. The part is designed for use in low voltage (3.3V/1.8V) applications which require a large number of outputs to drive precisely aligned, ultra low skew signals to their destination. The input is multiplexed from either HSTL or LVPECL (Low Voltage Positive Emitter Coupled Logic) by the CLK_SEL pin. The Output Enable (OE) is synchronous so that the outputs will only be enabled/disabled when they are already in the LOW state. This avoids any chance of generating a runt clock pulse when the device is enabled/disabled as can happen with an asynchronous control.The SY89824L features low pin-to-pin skew (50ps max.) and low part-to-part skew (200ps max.)--performance previously unachievable in a standard product having such a high number of outputs. The SY89824L is available in a single space saving package, enabling a lower overall cost solution.

Additional Features
    • 3.3V core supply, 1.8V output supply for reduced power
    • LVPECL and HSTL inputs
    • 22 differential HSTL (low-voltage swing) output pairs
    • HSTL outputs drive 50Ω to ground with no offset voltage
    • Low part-to-part skew (200ps max.)
    • Low pin-to-pin skew (50ps max.)
    • Available in a 64-Pin EPAD-TQFP
Parametrics
Name
Value
Product Type
Fanout & Buffer and Drivers
Description
2:22
Input
LVPECL/HSTL
Output
HSTL
Supply Voltage
3.3
Max Freq (GHz)
0.5
Max Prop Delay (ps)
1000
Icc (mA)
115
Max Within Device Skew (ps)
50
OE
True
RPE
False
FSI
False
Input Mux
True
Input EQ
False
Output Type
HSTL

Documents

Jump to:

Data Sheets

  
139KB

User Guides


Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SY89824LHZ-TR
0.261300
0.904600
64
TQFP
10x10x1.0mm
Matte Tin
e3
SY89824LHZ
0.261300
1.607500
64
TQFP
10x10x1.0mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

Buy from Microchip

Grid
View
Table
View
Filter:
Apply
Clear
Only show products with samples
Product
Leads
Package Type
Temp Range
Packing Media
5K Pricing
Buy