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SST25LF020A

2Mb 3-3.6V SPI Serial Flash

Status: In Production

Features:

  • Serial Interface Architecture – SPI Compatible: Mode 0 and Mode 3
  • Low Power Consumption: – Active Read Current: 7 mA (typical) – Standby Current: 8 µA (typical)
  • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 32 KByte overlay blocks
  • Fast Erase and Byte-Program: – Chip-Erase Time: 70 ms (typical) – Sector- or Block-Erase Time: 18 ms (typical) – Byte-Program Time: 14 µs (typical)
  • Auto Address Increment (AAI) Programming – Decrease total chip programming time over Byte-Program operations
  • Packages Available – 8-lead SOIC 150 mil body width for SST25LF020A – 8-contact WSON (5mm x 6mm)
  • All non-Pb (lead-free) devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

SST's serial flash family features a four-wire, SPI-compatible interface that allows for a low pin-count package occupying less board space and ultimately lowering total system costs. SST25LF020A SPI serial flash memories are manufactured with SST proprietary, high performance CMOS SuperFlash technology. The splitgate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.

Additional Features
  • Serial Interface Architecture– SPI Compatible: Mode 0 and Mode 3
  • Low Power Consumption:– Active Read Current: 7 mA (typical)– Standby Current: 8 µA (typical)
  • Flexible Erase Capability– Uniform 4 KByte sectors– Uniform 32 KByte overlay blocks
  • Fast Erase and Byte-Program:– Chip-Erase Time: 70 ms (typical)– Sector- or Block-Erase Time: 18 ms (typical)– Byte-Program Time: 14 µs (typical)
  • Auto Address Increment (AAI) Programming– Decrease total chip programming time overByte-Program operations
  • Packages Available– 8-lead SOIC 150 mil body widthfor SST25LF020A– 8-contact WSON (5mm x 6mm)
  • All non-Pb (lead-free) devices are RoHS compliant
Parametrics
Name
Value
Density
2 Mbit
Op. Volt Range (V)
3 to 3.6
Max. Clock Freq.
33 MHz
Temp Range (°C)
-40°C to +85°C
Data Retention (Years)
100
Bus Modes
SPI

Documents

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Brochures

12/19/2017
3698KB

Code Examples

MISC

06/24/2015
26KB

Development Environment

  • Programmers
  • Code Examples
Programmers
MPLAB PM3 Universal Device Programmer
MPLAB PM3 Universal Device Programmer ( DV007004 )

The MPLAB® PM3 Universal Device Programmer is easy to use and operates with a PC or as a stand-alone unit, and programs Microchip's entire line of PIC® devices as well as the latest dsPIC® DSC devices. When used standalone, data can be loaded and saved with the SD/MMC card (not included).

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST25LF020A-33-4C-QAE
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25LF020A-33-4C-SAE
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25LF020A-33-4C-SAE-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25LF020A-33-4E-SAE
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25LF020A-33-4E-SAE-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25LF020A-33-4I-SAE
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25LF020A-33-4I-SAE-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25LF020A-33-4C-QAE-T
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25LF020A-33-4E-QAE
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25LF020A-33-4E-QAE-T
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25LF020A-33-4I-QAE
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25LF020A-33-4I-QAE-T
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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