Log in to myMicrochip to access tools and benefits. Sign up in just one minute.
Maximize Your Experience: Reap the Personalized Advantages by Completing Your Profile to Its Fullest. Update Here
Stay in the loop with the latest from Microchip. Update your profile while you are at it. Update Here
Complete your profile to access more resources. Update Here
true
TB066
| Title |
Title
Temperature Sensor Backgrounder
|
|---|---|
| Name |
Name
TB066
|
| Date |
Date
06/24/2015
|
| Application Categories |
Application Categories
Signal Conditioning & Measurement /
Temperature Sensing
|
| Product Categories |
Product Categories
Thermal Management /
Logic Output Temp Sensors
Thermal Management /
Serial Output Temp Sensors
Thermal Management /
Voltage Output Temp Sensors
|
| Description |
Description
History has shown that consumers have an almost insatiable appetite for even greater computing horsepower. If you're old enough to remember, the mere thought of cryptic DOS software programs creeping along on your 286 platform just 16 years ago forces an almost irrepressible grin. However, as greater computing horsepower became available, our needs grew in direct proportion: the more capable the system, the more it could perform, and the more we depended onit. With this dependence came even greater demands for portability to match the life style of our highly mobile society. System manufacturers quickly realized that their next generation of equipment must be faster, more versatile and smaller. But increasing performance while reducing system size is a paradox in and of itself and creates other problems.Increasing system performance requires both advanced digital chip architectures and faster system clock rates. More advanced architectures result in a greater amount of circuitry on-chip. Higher system clock rates cause chips to run hotter (primarily because of energy losses from parasitic circuit effects). As a result, thermal problems arise from a larger amount of circuitry on each chip running considerably faster (and therefore hotter) than ever before. This problem is exacerbated by the small physical space in which modern systems are packaged (e.g. notebook form factor). Since the heat cannot be removed quickly, careful thermal management techniques must be incorporated into every modern system design.
|