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SiP and SOM Ease MPU Designs

If you would like to use a Microchip microprocessor but the increased hardware design complexity raises concerns, our Arm® processor-based System in Package (SiP) or System on Module (SOM) is your solution. Even developers with expertise in the design of an industrial-grade microprocessor (MPU)-based system spend a lot of time on PCB layout to guarantee signal integrity for the high-speed interfaces to DDR memory and Ethernet Physical layer (PHY) while complying with Electromagnetic Compatibility (EMC) standards.

System in Package

ATSMA5D2 MCUs

Key Benefits

  • Simplifies PCB design
  • 8–256 MB memory size options
  • Smallest footprint
  • Supports RTOS and Linux® OS
  • Reduces your supplier list

System on Module

ATSAMA5D2 SOM1

Key Benefits

  • Low-cost assembly
  • Mainlined Linux distribution
  • Customer-driven obsolescence
  • Qualified for production use
  • Single power rail

The integration of SDRAM, DDR2 or LPDDR2 memory and an MPU in a SiP removes the high-speed memory interface constraints from the PCB and reduces its size. A SOM takes it another step further by integrating power management, Ethernet PHY, nonvolatile boot memory and an optional wireless module on a small PCB. It offers single supply and standard surface mount manufacturing technology similar to a QFP package and can even be hand soldered during initial prototyping.

If you are developing Linux-based applications, you will have access to our extensive set of device drivers, middleware and application layers for the embedded market at no charge. All our Linux development code for the SiP and SOM are mainlined in the Linux communities. This means you can develop solutions to connect external devices, for which drivers are mainlined, to the SOM and SIP with minimal software development.