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System in Packages and System on Modules
Integrated Solutions to Simplify Designs and Speed Up Development
SiP and SOM Products
System in Packages (SiPs)
SiPs integrate SDRAM, DDRx or LPDDRx memory and an MPU, removing the high-speed memory interface constraints from the PCB and reducing its size. Some of our SiPs include an optional TA100 secure element.
Key Benefits
- Simplifies PCB design
- 64 Mb to 4 Gb memory size options
- Smallest footprint
- Supports RTOS and Linux® OS
- Reduces your supplier list
System on Modules
A SOM takes it a step further by integrating power management, an Ethernet PHY, nonvolatile boot memory and an optional wireless module on a small PCB. A SOM offers single-supply and standard surface-mount manufacturing technology, similar to a QFP package, and can even be hand soldered during initial prototyping. They are supported by our MPLAB® development ecosystem for bare metal, RTOS-based embedded systems and the Linux® OS environment.
Key Benefits
- Low-cost assembly
- Mainlined Linux distribution
- Customer-driven obsolescence
- Qualified for production use
- Single power rail