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PIC24EP64GP202

70 MIPS Microcontroller with Internal Op Amps

Status: In Production

Features:

  • ADC module Configurable as 10-bit, 1.1 Msps with four S&H or 12-bit, 500 ksps with one S&H
  • Up to three Op amp/Comparators
  • Peripheral Trigger Generator (PTG) for scheduling complex sequences
  • Two UART modules (15 Mbps)
  • Two 4-wire SPI modules (15 Mbps)
  • Two I2C™ modules (up to 1 Mbaud) with SMBus support
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The PIC24E general purpose MCUs feature the high speed 70 MIPS core with excellent performance and code density. It offers superior ADC performance, CTMU, Op Amps and Peripheral Trigger Generator (PTG) for high-end general purpose applications. These devices are available in various packages and with extended (125°C) temp option.

Additional Features
  • Operating Conditions
    • 3.0V to 3.6V, -40ºC to +85ºC, DC to 70 MIPS
    • 3.0V to 3.6V, -40ºC to +125ºC, DC to 60 MIPS
  • PIC24E MCU Core
    • Modified Harvard Architecture
    • C Compiler Optimized Instruction Set
    • 16-bit Wide Data Path
    • 24-bit Wide Instructions
    • 16x16 Integer Multiply Operations
    • 32/16 and 16/16 Integer Divide Operations
  • Advanced Analog Features
    • ADC module Configurable as 10-bit, 1.1 Msps with four S&H or 12-bit, 500 ksps with one S&H
    • Up to three Op amp/Comparators
    • Op Amp direct connection to the ADC module
    • Additional dedicated comparator
    • Programmable references with 32 voltage points for comparators
    • Charge Time Measurement Unit (CTMU) supports mTouch™ capacitive touch sensing
  • Timers/Output Compare/Input Capture
    • 12 general purpose timers
    • Five 16-bit and up to two 32-bit timers/counters
    • Four OC modules configurable as timers/counters
    • Four IC modules
    • Peripheral Trigger Generator (PTG) for scheduling complex sequences
    • PTG module with two configurable timers/counters
  • Communication Interfaces
    • Two UART modules (15 Mbps)
    • Two 4-wire SPI modules (15 Mbps)
    • Two I2C™ modules (up to 1 Mbaud) with SMBus support
    • PPS to allow function remap
    • Programmable Cyclic Redundancy Check (CRC)
  • Direct Memory Access (DMA)
    • 4-channel DMA with user selectable priority arbitration
    • UART, SPI, ADC, IC, OC, and Timers
Parametrics
Name
Value
Architecture
16-bit
Max CPU Speed (MHz)
70
CPU Speed (MIPS/DMIPS)
70
Program Memory Size (KB)
64
SRAM (KB)
8
Direct Memory Access Channels
4
Temperature Range (C)
-40 to 125
Operating Voltage Range (V)
3 to 3.6
Pin Count
28
Comparators
3
Analog Peripherals
1-A/D 6x12-bit @ 500(ksps) 1-D/A 0x4-bit
UART
2
SPI
2
I2C
2
Timers
5 x 16-bit 2 x 32-bit
Input Capture
4
Output Compare Channels
4
Class B Hardware
Yes
Peripheral Trigger Generator
Yes
Peripheral Pin Select / Pin Muxing
Yes
Supported in MPLAB Code Configurator
Yes

Documents

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Reference Manual

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03/18/2014
668KB
03/14/2014
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Software

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Development Environment

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  • Socket: AC164337   PartNo: PIC24EP64GP202 (28SP)
  • Socket: AC164339   PartNo: PIC24EP64GP202 (28SO)
  • Socket: AC164338   PartNo: PIC24EP64GP202 (28SS)
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC24EP64GP202-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC24EP64GP202-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC24EP64GP202-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC24EP64GP202-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
PIC24EP64GP202T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
PIC24EP64GP202-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24EP64GP202T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24EP64GP202-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24EP64GP202T-H/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
PIC24EP64GP202-H/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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