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MCP3301

13-Bit, 100kSPS, Single Channel ADC

Status: In Production

Features:

  • 13-bit resolution
  • Differential input
  • SPI interface
  • ±1 LSB DNL
  • ±1 LSB INL
  • 100 ksps sample
  • -40 to +85°C temperature range
  • AEC-Q100 Grade 3
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The MCP3301 13-bit Analog to Digital Converter (ADC) features a full differential input and low power consumption in a small package that is ideal for battery powered systems and remote data acquisition applications. The industry-standard SPI™ serial interface enables 13-bit ADC capability to be added to any PICmicro® microcontroller. The MCP3301 features 100k samples/second, 1 input channel, low power consumption (300 nA typical standby, 450µA maximum active), and is available in 8-pin PDIP, SOIC and MSOP packages. The full differential input of the MCP3301 enables a wide variety of signals to be used in applications such as remote data acquisition, portable instrumentation, and battery operated applications.

Additional Features
    • 13-bit resolution
    • Differential input
    • SPI interface
    • ±1 LSB DNL
    • ±1 LSB INL
    • 100 ksps sample
    • -40 to +85°C temperature range
    • AEC-Q100 Grade 3
Parametrics
Name
Value
Max Sample Rate (ksamples/sec)
100
Typ. INL ± (LSB)
0.5(Grade B), 1(Grade C)
Max. Supply Current (µA)
450
Input Type
Differential
# of Input Channels
1
Resolution (bits)
13
Interface
SPI
Temp Range (°C)
-40 to +85°C
Input Voltage Range (V)
0 to 5.5

Documents

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Data Sheets

  
990KB

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP3301-BI/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
MCP3301-CI/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
MCP3301T-BI/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
MCP3301T-CI/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
MCP3301-BI/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP3301-CI/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP3301T-BI/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP3301T-CI/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP3301-BI/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP3301-CI/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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