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ATSAM4N16B

Status: In Production

Features:

  • ARM Cortex-M4 running at up to 100 MHz
  • Memory Protection Unit (MPU)
  • DSP Instructions, Floating Point Unit (FPU), Thumb®-2 instruction set
  • 1024 Kbytes embedded Flash
  • 80 Kbytes embedded SRAM
  • 8 Kbytes ROM with embedded boot loader routines (UART, USB) and IAP routines
  • Embedded voltage regulator for single-supply operation
  • Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for Safe Operation
  • Quartz or ceramic resonator oscillators: 3 to 20 MHz with clock failure detection and 32.768 kHz for RTT or system clock
  • Slow clock internal RC oscillator as permanent low-power mode device clock
  • High-precision 8/12 MHz factory-trimmed internal RC oscillator with 4 MHz default frequency for device startup, in-application trimming access for frequency adjustment
  • PLL up to 240 MHz for Device Clock
  • Temperature Sensor
  • Low-power tamper detection on two inputs, anti-tampering by immediate clear of general-purpose backup registers (GPBR)
  • 23 Peripheral DMA Controllers
  • Sleep, Wait, and Backup modes, down to 0.7 μA in Backup mode with RTC, RTT, and GPBR
  • 64-lead LQFP, 14 x 14 mm, pitch 0.5 mm
  • 64-lead QFN, 9 x 9 mm, pitch 0.5 mm
  • Industrial (-40° C to +85° C)
  • Up to 2 USARTs with ISO7816, IrDA (only USART0), RS-485, and SPI Mode
  • Up to 4 two-wire UARTs
  • Up to 3 Two-wire Interfaces (TWI)
  • 1 SPI
  • 2 Three-channel 16-bit Timer Counter blocks with capture, waveform, compare and PWM mode, Quadrature Decoder Logic and 2-bit Gray Up/Down for Stepper Motor
  • 1 Four-channel 16-bit PWM
  • 32-bit low-power Real-time Timer (RTT) and low-power Real-time Clock (RTC) with calendar and alarm features
  • 256-bit General Purpose Backup Registers (GPBR)
  • 47 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination.  Individually Programmable Open-drain, Pull-up and Pull-down resistor and Synchronous Output
  • Three 32-bit Parallel Input/Output Controllers, Peripheral DMA-assisted Parallel Capture mode
  • One 10-bit ADC up to 510 ksps, with Digital Averaging Function providing Enhanced Resolution Mode up to 12-bit, up to 16-channels
  • One 10-bit DAC up to 1 msps Internal voltage reference, 3V typ
  • Serial Wire/JTAG Debug Port(SWJ-DP)
  • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.
  • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.
  • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.
  • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.
  • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.
  • IEEE1149.1 JTAG Boundary-scan on all digital pins.
  • ASF-Atmel software Framework – SAM software development framework
  • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.
  • DMA support, Interrupt handlers Driver support
  • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks
  • RTOS integration, FreeRTOS is a core component
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Overview
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Development Environment
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Device Overview

Summary

Microchip's ATSAM4N16B ARM® Cortex®-M4-based microcontroller runs at 100MHz and features 1MB of flash memory and 80KB of SRAM.

Peripherals include six USARTs, three SPIs and three I2Cs for fast serial communication, as well as a 10-channel 12-bit ADC, a 10-bit DAC, PWM, timers and RTC.

The device operates from 1.62V to 3.6 V and is available in 64-pin QFP and QFN packages

Pin-to-pin compatible with SAM3N, SAM3S products (48/64/100-pin versions), SAM4S (64/100-pin versions) and SAM7S legacy products (64-pin version).

Additional Features

    Microcontroller Features

    Core

    • ARM Cortex-M4 running at up to 100 MHz

    • Memory Protection Unit (MPU)

    • DSP Instructions, Floating Point Unit (FPU), Thumb®-2 instruction set

    Memories

    • 1024 Kbytes embedded Flash

    • 80 Kbytes embedded SRAM

    • 8 Kbytes ROM with embedded boot loader routines (UART, USB) and IAP routines

    System

    • Embedded voltage regulator for single-supply operation

    • Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for Safe Operation

    • Quartz or ceramic resonator oscillators: 3 to 20 MHz with clock failure detection and 32.768 kHz for RTT or system clock

    • Slow clock internal RC oscillator as permanent low-power mode device clock

    • High-precision 8/12 MHz factory-trimmed internal RC oscillator with 4 MHz default frequency for device startup, in-application trimming access for frequency adjustment
    • PLL up to 240 MHz for Device Clock

    • Temperature Sensor

    • Low-power tamper detection on two inputs, anti-tampering by immediate clear of general-purpose backup registers (GPBR)

    • 23 Peripheral DMA Controllers

    Low Power modes

    • Sleep, Wait, and Backup modes, down to 0.7 μA in Backup mode with RTC, RTT, and GPBR

    Package

    • 64-lead LQFP, 14 x 14 mm, pitch 0.5 mm

    • 64-lead QFN, 9 x 9 mm, pitch 0.5 mm

    Temperature operating range

    • Industrial (-40° C to +85° C)

    Peripheral Features

    • Up to 2 USARTs with ISO7816, IrDA (only USART0), RS-485, and SPI Mode

    • Up to 4 two-wire UARTs

    • Up to 3 Two-wire Interfaces (TWI)

    • 1 SPI

    • 2 Three-channel 16-bit Timer Counter blocks with capture, waveform, compare and PWM mode, Quadrature Decoder Logic and 2-bit Gray Up/Down for Stepper Motor

    • 1 Four-channel 16-bit PWM

    • 32-bit low-power Real-time Timer (RTT) and low-power Real-time Clock (RTC) with calendar and alarm features

    • 256-bit General Purpose Backup Registers (GPBR)

    I/O

    • 47 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination.  Individually Programmable Open-drain, Pull-up and Pull-down resistor and Synchronous Output

    • Three 32-bit Parallel Input/Output Controllers, Peripheral DMA-assisted Parallel Capture mode

    Analog Features

    • One 10-bit ADC up to 510 ksps, with Digital Averaging Function providing Enhanced Resolution Mode up to 12-bit, up to 16-channels

    • One 10-bit DAC up to 1 msps

      Internal voltage reference, 3V typ

    Debugger Development Support

    • Serial Wire/JTAG Debug Port(SWJ-DP)

    • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.

    • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.

    • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.

    • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.

    • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.

    • IEEE1149.1 JTAG Boundary-scan on all digital pins.

    Integrated Software Libraries and Tools

    • ASF-Atmel software Framework – SAM software development framework

    • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.

    • DMA support, Interrupt handlers Driver support

    • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks

    • RTOS integration, FreeRTOS is a core component

Parametrics
Name
Value
Part Family
ATSAM4N16B
Max CPU Speed MHz
100
Program Memory Size (KB)
1024
SRAM (KB)
80
Temperature Range (C)
-40 to 85
Operating Voltage Range (V)
1.62 to 3.6
Direct Memory Access Channels
23
SPI
3
I2C
3
Peripheral Pin Select / Pin Muxing
Yes
ADC Input
10
Max ADC Resolution (Bits)
10
Max ADC Sampling Rate (ksps)
500
Number of DACs
1
Input Capture
12
Max 16-bit Digital Timers
6
Internal Oscillator
4,8,12Mhz,32Khz
Hardware RTCC/RTC
Yes
Max I/O Pins
47
Pincount
64
Quadrature Encoder Interface
1

Documents

Jump to:

Data Sheet

03/01/2015
3619KB

Application Notes

Download All

User Guides

12/10/2016
3354KB

White Papers

05/01/2013
443KB

Development Environment

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATSAM4N16BA-AU
0.166700
1.087500
64
LQFP
10x10x1.4mm
Matte Tin
e3
ATSAM4N16BA-AUR
0.166700
0.366667
64
LQFP
10x10x1.4mm
Matte Tin
e3
ATSAM4N16BA-MU
0.224700
0.969231
64
VQFN
9x9x1mm
Matte Tin
e3
ATSAM4N16BA-MUR
0.224700
0.225143
64
VQFN
9x9x1mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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