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TC7660H

High Frequency Charge Pump DC-DC Voltage Converter

Status: In Production

Features:

  • Pin Compatible with 7660, High Frequency-Performance DC-to-DC Converter
  • Low Cost, Two Low Value External Capacitors Required (1.µF)
  • Converts +5V Logic Supply to ±5V System
  • Voltage Conversion: 99.7%
  • Power Efficiency: 85%
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The TC7660H is a pin-compatible,high frequency up-grade to the Industry standard TC7660 charge pump voltage converter.It converts a +1.5V to +10V input to a corresponding – 1.5V to – 10V output using only two low--cost capacitors,eliminating inductors and their associated cost,size and EMI. The TC7660H operates at a frequency of 120kHz (versus 10kHz for the TC7660),allowing the use of 1.0 µF external capacitors.Oscillator frequency can be reduced (for lower supply current applications)by connecting an external capacitor from OSC to ground. The TC7660H is available in 8-pin DIP and small outline (SOIC)packages in commercial and extended temperature ranges.

Additional Features
    • Pin Compatible with 7660, High Frequency-Performance DC-to-DC Converter
    • Low Cost, Two Low Value External Capacitors Required (1.µF)
    • Converts +5V Logic Supply to ±5V System
    • Voltage Conversion: 99.7%
    • Power Efficiency: 85%
Parametrics
Name
Value
Typical Active Output Current (mA)
20
Output Voltage (V)
Vout = -Vin or Vout = 2Vin
Typical Quiescent Current (µA)
460
Input Voltage Range (V)
1.5 to 10
Device Description
Inverting or Doubling

Documents

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Data Sheet

02/05/2013
490KB

Product Line Card

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
TC7660HCOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7660HCOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7660HEOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7660HEOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7660HCPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
TC7660HEPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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