Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes
product primary image

PM8310

TEMUX-336 High Density T1/E1 Framer, & Mapper

Status: In Production

Features:

  • 8 OC-3/STM-1 or 2 OC-12/STM-4 SONET/SDH framers (working and protection)
  • 336 T1/252 E1 framers
  • 12 M13 multiplexers, including support for G.747 multiplexing
  • 12 DS3/E3 framers
  • High order path processor for a SONET STS-12 or an SDH STM-4
View More
Overview
Documents
Development Environment
RoHS Information
Add to Cart

Device Overview

Summary

The PM8310 TEMUX-336 is a high density T1/E1 framer, VT/TU mapper, and M13 multiplexer with integrated SONET/SDH framers for OC- 12/STM-4 and 4xOC-3/STM-1 applications. Feature integration and scalability make the TEMUX-336 ideal for use in ATCA/AMC line cards, voice and media gateways, routers, and multi-service and edge aggregation switches.

The TEMUX-336 device's unique Extended Serial SONET/SDH Interface (ESSI) enables:
• A low pin-count interconnect to additional TEMUX-336 devices for equipment protection applications
• Higher-rate SONET/SDH framers such as the PM5336 ARROW-2488 for channelized OC-48/STM-16 designs
• SONET/SDH cross-connects in transport applications
• Ethernet over SONET/SDH mappers such as the PM4390 ARROW M8xFE
• Additionally, the device's Scalable Bandwidth Interconnect (SBI) bus enables a simple interconnect to Microchip Layer 2 solutions such as the FREEDM (HDLC processor), S/UNI IMA (ATM inverse multiplexer) and AAL1gator (ATM-based CES processor) families.

Benefits
• Complete SONET/SDH front end with T1/E1, DS3/E3 ATCA/AMC space and power constraints
• Integrated SBI bus simplifies interconnection to layer 2 processors
• Meets timing requirements for wireless backhaul, critical for CESbased 336/252 T1/E1s across the SBI using the V4 byte
• Extended Serial SONET/SDH Interface (ESSI) can aggregate up to 4x protection in ACTA/AMC systems
• Supports linear 1+1 protection on the same device or to a companion TEMUX-336 device
• Enables a scalable architecture from T1/E1 up to OC-12/STM-4
• Supports T1/E1 mapping directly into SONET/SDH using VT1.5/TU-11 or VT2/TU-12 or multiplexed in DS3s using M13 or G.747
• Supports advanced test features including programmable pattern generation and detection for up to 64 byte sequences
• Fully integrated, monolithic IC ensures reliability

Applications
• ATCA/AMC-based line cards
• Voice and media gateways
• Wireless base station controllers (BSC) and radio network controllers (RNC)
• Routers and multi-service switches
• Edge aggregation switches
• Multi-service provisioning platforms

Additional Features
  • 8 OC-3/STM-1 or 2 OC-12/STM-4 SONET/SDH framers (working and protection)
  • 336 T1/252 E1 framers
  • 12 M13 multiplexers, including support for G.747 multiplexing
  • 12 DS3/E3 framers
  • High order path processor for a SONET STS-12 or an SDH STM-4
  • Tributary path processor for 336 VT1.5/TU-11s or 252 VT2/TU-12s
  • Byte-synchronous and bit-asynchronous mapper for 336 VT1.5/TU-11s or 252 VT2/TU-12s
  • Tributary path processor for 12 TU-3s
  • Mapper for 12 DS3s or 12 E3s (TU-3 and AU-3)
  • Up to 8 SONET/SDH Network interfaces (working and protection); 2 may operate at OC-12/STM-4 rates
  • SONET/SDH Transport and Path overhead interfaces
  • Two 622-Mbit/s Extended Serial SONET/SDH interfaces (ESSIs)
  • Line side serial interface for up to 12 DS3s or E3s
  • System-side 77.76 Scalable Bandwidth Interconnect (SBI336) bus for high-density interconnection of up to 336 T1 streams, 252 E1 streams, 12 DS3 streams, 12 E3 streams, or 12 arbitrary rate streams
  • System-side serial interface for up to 12 DS3s or E3s
  • Flexible bandwidth interface for up to 12 fractional rate links
  • 32 Mbit/s synchronous TDM interface (based on H-MVIP)
  • Microprocessor- and IEEE 1149.1-compliant JTAG interface
  • 16-bit microprocessor interface
  • Supports transparent virtual tributaries (TVT) where VT1.5/TU-11 and VT2/TU-12 payloads are transported intact between the line side and the SBI336 bus with pointer processing and low order path processing; TVT mode is configurable on a pertributary basis
  • Provides optional jitter attenuation on the T1/E1 transmit and receive paths, and DS3/E3 transmit and receive paths including DS3/E3s demapped from SONET/SDH
  • 896-pin FCBGA (31 x 31 mm)
  • Supports industrial temperature range (-40 °C to 85 °C)

Documents

Jump to:

Data Sheets

Brochures

  
297KB

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PM8310A-FXI
0.000000
12.48148
896
HBGA
31x31mm
SnPb
e0
PM8310A-FEI
0.000000
12.48148
896
HBBGA
31x31x3.12mm
SAC305
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

Buy from Microchip

Grid
View
Table
View
Filter:
Apply
Clear
Only show products with samples
Product
Leads
Package Type
Temp Range
Packing Media
5K Pricing
Buy