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24LC02B

2Kb I2C compatible 2-wire Serial EEPROM

Status: In Production

Features:

  • Single supply with operation down to 2.5V for 24LC02B devices
  • Low-power CMOS technology
  • 2-wire serial interface, I2C™ compatible
  • Schmitt Trigger inputs for noise suppression
  • Output slope control to eliminate ground bounce
  • 100 kHz and 400 kHz clock compatibility
  • Page write time 3 ms, typical
  • More than 1 million erase/write cycles
  • Data retention >200 years
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The Microchip Technology Inc. 24AA02/24LC02B is a 2Kb I2C™ compatible Serial EEPROM. The device is organized as one block of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7V, with standby and active currents of only 1 µA and 1 mA, respectively. The 24XX02 also has a page write capability for up to 8 bytes of data. The 24XX02 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages and is also available in the 5-lead SOT-23 package.

Additional Features
    • Single supply with operation down to 2.5V for 24LC02B devices
    • Low-power CMOS technology
    • 2-wire serial interface, I2C™ compatible
    • Schmitt Trigger inputs for noise suppression
    • Output slope control to eliminate ground bounce
    • 100 kHz and 400 kHz clock compatibility
    • Page write time 3 ms, typical
    • More than 1 million erase/write cycles
    • Data retention >200 years
Parametrics
Name
Value
Density
2K bits (x8)
Op. Volt Range (V)
2.5 to 5.5
Max. Clock Freq.
400 kHz
Page Size (bytes)
8
Write Protect
Whole Array
Temp Range (°C)
-40°C to +125°C
Endurance
1,000,000

Documents

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Supporting Collateral

Board Design Files

Development Environment

  • Programmers
  • Demo & Evaluation Boards
Programmers
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The MPLAB® PM3 Universal Device Programmer is easy to use and operates with a PC or as a stand-alone unit, and programs Microchip's entire line of PIC® devices as well as the latest dsPIC® DSC devices. When used standalone, data can be loaded and saved with the SD/MMC card (not included).

  • Socket: AC164368   PartNo: 24LC02B (8MC)
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Demo & Evaluation Boards
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The Serial EEPROM PIM PICtail™ Modules are a series of boards designed around Microchip Serial EEPROM devices. The boards are designed to interface with the PICtail Plus connector as well as the MPLAB® Starter Kit for Serial Memory Products and the PICkit™ 2, allowing you to get started right out of the box.

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Product
Memory Size
Memory Speed
Package
Price 5K
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SOIC-8, SOT-23-5
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MSOP-8, PDIP-8, SC70-5, SOIC-8, SOT-23-5, TDFN-8, TSSOP-8
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1 MHz
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
24LC02BT-E/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
24LC02B-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
24LC02BH-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
24LC02BH-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
24LC02BHT-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
24LC02BHT-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
24LC02B-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
24LC02BT-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
24LC02BT-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
24LC02BT-I/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
24LC02BT-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
24LC02BT-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
24LC02BHT-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
24LC02BHT-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
24LC02B/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
24LC02B-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BT/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BT-E/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BT-E/ST16KVAO
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BT-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
24LC02B-E/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BH-E/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BH-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BHT-E/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
24LC02BHT-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
24LC02B/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02B-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02B-E/SN16KVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02B-E/SNG
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BH-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BH-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BHT-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BHT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02B-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02B-I/SNG
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BT/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BT-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BT-E/SN16KVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
24LC02BHT-E/LT
0.006300
0.033333
5
SC70
-
Matte Tin
e3
24LC02BT-E/LT
0.006300
0.033333
5
SC70
-
Matte Tin
e3
24LC02BT-I/LT
0.006300
0.033333
5
SC70
-
Matte Tin
e3
24LC02BHT-I/LT
0.006300
0.033333
5
SC70
-
Matte Tin
e3
24LC02BHT-I/OT
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
24LC02BHT-E/OT
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
24LC02BT-E/OT
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
24LC02BT-E/OT16KVAO
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
24LC02BT-I/OT
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
24LC02B/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
24LC02B-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
24LC02B-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
24LC02BH-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
24LC02BH-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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