Microchip Technology Inc
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IS2020

Status: In Production

Features:

  •  Compliant with Bluetooth Specification v.4.1 (EDR) in 2.4 GHz ISM band
  •  HFP 1.6
  •  HSP 1.1
  •  A2DP 1.2
  •  AVRCP 1.5
  •  SPP 1.0
  •  PBAP 1.0
  • 16MHz main clock input
  • Built-in internal ROM for program memory
  • Support to connect to two hosts ( phones, tablets…) with HFP or A2DP profiles simultaneously
  • Adaptive Frequency Hopping (AFH) avoids occupied RF channels
  • Fast Connection supported RF Hardware
  • Fully Bluetooth 4.1 (EDR) system in 2.4 GHz ISM band
  • Combined TX/RX RF terminal simplifies external matching and reduces external antenna switches
  • Max. +4dBm output power with 20 dB level control from register control
  • Built-in T/R switch for Class 2/3 application
  • To avoid temperature variation, temperature sensor with temperature calibration is utilized into bias current and gain control
  • Fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter
  • Crystal oscillation with built-in digital trimming for temperature/process variations
  • Supports 64 kb/s A-Law or µ-Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation
  • Noise suppression
  • Echo suppression
  • SBC and optional AAC decoding
  • Packet loss concealment
  • Build-in four languages (Chinese/ English/ Spanish/ French) voice prompts and 20 events for each one (This function can be set up in UI tool.)
  • 20 bit DAC and 16 bit ADC codec
  • 98dB SNR DAC playback
  • Built-in Lithium-ion battery charger (up to 350mA)
  • Integrate 3V, 1.8V configurable switching regulator and LDO
  • Built-in ADC for battery monitor and voltage sense
  • A line-in port for external audio input
  • Two LED drivers
  • High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps) Package
  • 7 x 7 mm2 56QFN package
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The IS2020 Stereo Audio Chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth v4.1 with Enhanced Data Rate 2.4GHz applications. This chip is fully compliant with Bluetooth specification and completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems.  It incorporates Bluetooth 1M/2M/3Mbps RF, single-cycle 8bit MCU, TX/RX modem, 5-port memory controller, task/hopping controller, UART interface, and Microchip’s own Bluetooth software stack to achieve the required BT v4.1 with EDR functions.

To provide the superior audio and voice quality, it also integrates a DSP co-processor, a PLL, and a CODEC dedicated for voice and audio applications.  For voice, not only basic CVSD encoding and decoding but also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both sending and receiving sides. For the enhanced audio applications, SBC/AAC_LC decoding functions can be also carried out by DSP to satisfy Bluetooth A2DP requirements.

In addition, to minimize the external components required for portable devices, a battery voltage sensor, battery charger, a switching regulator and LDO are integrated to reduce system BOM cost for various Bluetooth applications.

Additional Features
      System Specification
      •  Compliant with Bluetooth Specification v.4.1 (EDR) in 2.4 GHz ISM band
      •  It supports the following profiles :
        •  HFP 1.6
        •  HSP 1.1
        •  A2DP 1.2
        •  AVRCP 1.5
        •  SPP 1.0
        •  PBAP 1.0
      Baseband Hardware
      • 16MHz main clock input
      • Built-in internal ROM for program memory
      • Support to connect to two hosts ( phones, tablets…) with HFP or A2DP profiles simultaneously
      • Adaptive Frequency Hopping (AFH) avoids occupied RF channels
      • Fast Connection supported RF Hardware
      • Fully Bluetooth 4.1 (EDR) system in 2.4 GHz ISM band
      • Combined TX/RX RF terminal simplifies external matching and reduces external antenna switches
      • Max. +4dBm output power with 20 dB level control from register control
      • Built-in T/R switch for Class 2/3 application
      • To avoid temperature variation, temperature sensor with temperature calibration is utilized into bias current and gain control
      • Fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter
      • Crystal oscillation with built-in digital trimming for temperature/process variations
      Audio processor
      • Supports 64 kb/s A-Law or µ-Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation
      • Noise suppression
      • Echo suppression
      • SBC and optional AAC decoding
      • Packet loss concealment
      • Build-in four languages (Chinese/ English/ Spanish/ French) voice prompts and 20 events for each one (This function can be set up in UI tool.)
      Audio Codec
      • 20 bit DAC and 16 bit ADC codec
      • 98dB SNR DAC playback
      • Built-in Lithium-ion battery charger (up to 350mA)
      • Integrate 3V, 1.8V configurable switching regulator and LDO
      • Built-in ADC for battery monitor and voltage sense
      • A line-in port for external audio input
      • Two LED drivers
      Flexible HCI interface
      • High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps) Package
      • 7 x 7 mm2 56QFN package
Parametrics
Name
Value
Bluetooth Classic-Data/SPP
Yes
Bluetooth Classic-Audio
Yes
Audio Channels
Stereo
Analog Audio Out
Yes
MIC-in
2
Line-in
Yes
I2C
1
TX Power
+4dBm
GPIO
9
Pin Count
56
Package Type
QFN
Package Size
7 x 7 mm
Temperature Range
-20C to 70C
Operating Voltage Range
3.0 to 4.25

Documents

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Data Sheets

07/13/2015
2730KB

Software

03/09/2017
22045KB
10/14/2016
21824KB

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight
Shipping Weight
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
IS2020S-002
0.136500
0.301333
56
VQFN
7x7x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
IS2020S-002-TRAY
0.136500
0.471154
56
VQFN
7x7x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
IS2020S-203
0.136500
0.301333
56
VQFN
7x7x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
IS2020S-203-TRAY
0.136500
0.471154
56
VQFN
7x7x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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