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USB3250

Status: In Production

Features:

  • USB-IF "Hi-Speed" Certified to USB 2.0 Electrical Specification
  • Interface Compliant with the UTMI Specification (60MHz 8-bit Unidirectional Interface and 30MHz 16-bit Bidirectional Interface)
  • Supports 480Mbps High Speed (HS) and 12Mbps Full Speed (FS) Serial Data Transmission Rates
  • Integrated 45 Ohm and 1.5k Ohm Termination Resistors Reduce External Component Count
  • Internal Short Circuit Protection of DP and DM Lines
  • On-Chip Oscillator Operates with Low Cost 12MHz Crystal
  • Robust and Low Power Digital Clock and Data Recovery Circuit
  • SYNC and EOP Generation on Transmit Packets and Detection on Receive Packets
  • NRZI Encoding and Decoding
  • Bit Stuffing and Unstuffing with Error Detection
  • Supports the USB Suspend State, HS Detection, HS Chirp, Reset and Resume
  • Support for All Test Modes Defined in the USB 2.0 Specification
  • Draws 72mA (185mW) Maximum Current Consumption in HS Mode - Ideal for Bus Powered Functions
  • On-Die Decoupling Capacitance and Isolation for Immunity to Digital Switching Noise
  • Available in a 56-Pin QFN Package
  • Full Industrial Operating Temperature Range from -40°C to +85°C (Ambient)
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The USB3250 provides the Physical Layer (PHY) interface to a USB 2.0 Device Controller. The IC is available in a 56 pin QFN.

The USB3250 is a USB 2.0 physical layer transceiver (PHY) integrated circuit. Microchip's proprietary technology results in low power dissipation, which is ideal for building a bus powered USB 2.0 peripheral. The PHY can be configured for either an 8-bit unidirectional or a 16-bit bidirectional parallel interface, which complies with the USB Transceiver Macrocell Interface (UTMI) specification. It supports 480Mbps transfer rate, while remaining backward compatible with USB 1.1 legacy protocol at 12Mbps.

All required termination for the USB 2.0 Transceiver is internal. Internal 5.25V short circuit protection of DP and DM lines is provided for USB compliance.

While transmitting data, the PHY serializes data and generates SYNC and EOP fields. It also performs needed bit stuffing and NRZI encoding. Likewise, while receiving data, the PHY de-serializes incoming data, stripping SYNC and EOP fields and performs bit un-stuffing and NRZI decoding.


*The USBCheck online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.

Additional Features

    Features

    • USB-IF "Hi-Speed" Certified to USB 2.0 Electrical Specification
    • Interface Compliant with the UTMI Specification (60MHz 8-bit Unidirectional Interface and 30MHz 16-bit Bidirectional Interface)
    • Supports 480Mbps High Speed (HS) and 12Mbps Full Speed (FS) Serial Data Transmission Rates
    • Integrated 45 Ohm and 1.5k Ohm Termination Resistors Reduce External Component Count
    • Internal Short Circuit Protection of DP and DM Lines
    • On-Chip Oscillator Operates with Low Cost 12MHz Crystal
    • Robust and Low Power Digital Clock and Data Recovery Circuit
    • SYNC and EOP Generation on Transmit Packets and Detection on Receive Packets
    • NRZI Encoding and Decoding
    • Bit Stuffing and Unstuffing with Error Detection
    • Supports the USB Suspend State, HS Detection, HS Chirp, Reset and Resume
    • Support for All Test Modes Defined in the USB 2.0 Specification
    • Draws 72mA (185mW) Maximum Current Consumption in HS Mode - Ideal for Bus Powered Functions
    • On-Die Decoupling Capacitance and Isolation for Immunity to Digital Switching Noise
    • Available in a 56-Pin QFN Package
    • Full Industrial Operating Temperature Range from -40°C to +85°C (Ambient)
Parametrics
Name
Value
Description
USB 2.0 UTMI PHY IC
Upstream Port
UTMI
Reference Clock Freq
12MHz
I/O Voltage (V)
3.3V
Crystal Support
Yes
Temp. Range Min.
-40
Temp. Range Max.
85

Documents

Jump to:

IBIS

07/05/2007
72KB

Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
USB3250-ABZJ
0.182400
1.192308
56
VQFN
8x8x0.9
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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