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TC7662B

Charge Pump DC-DC Voltage Converter

Status: In Production

Features:

  • Boost Pin (Pin 1) for Higher Switching Frequency
  • High Power Efficiency is 96%
  • Easy to Use – Requires Only 2 External Non-Critical Passive Components
  • Improved Direct Replacement for Industry Standard ICL7660 and Other Second Source Devices
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The TC7662B is a pin-compatible upgrade to the Industry standard TC7660 charge pump voltage converter. It converts a +1.5V to +15V input to a corresponding – 1.5 to – 15V output using only two low-cost capacitors, eliminating inductors and their associated cost, size and EMI. The on-board oscillator operates at a nominal frequency of 10kHz. Frequency is increased to 35kHz when pin 1 is connected to V + , allowing the use of smaller external capacitors. Operation below 10kHz (for lower supply current applications) is also possible by connecting an external capacitor from OSC to ground (with pin 1 open). The TC7662B is available in both 8-pin DIP and 8-pin small outline (SO) packages in commercial and extended temperature ranges.

Additional Features
    • Boost Pin (Pin 1) for Higher Switching Frequency
    • High Power Efficiency is 96%
    • Easy to Use – Requires Only 2 External Non-Critical Passive Components
    • Improved Direct Replacement for Industry Standard ICL7660 and Other Second Source Devices
Parametrics
Name
Value
Typical Active Output Current (mA)
20
Output Voltage (V)
Vout = -Vin or Vout = 2Vin
Typical Quiescent Current (µA)
180
Input Voltage Range (V)
1.5 to 15
Operating Temp. Range (°C)
-45 to 85
Device Description
Inverting or Doubling

Documents

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Data Sheets

06/24/2015
506KB

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
TC7662BCOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7662BCOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7662BEOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7662BEOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC7662BCPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
TC7662BEPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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