Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes
product primary image

TC1302A

Low Quiescent Current Dual Output LDO

Status: In Production

Features:

  • Dual Output LDO
  • Low Dropout Voltage
  • Low Supply Current: 116 µA Typical
  • Reference Bypass Input for Low-Noise Operation
  • Overtemperature adn Overcurrent Protection
View More
Overview
Documents
Development Environment
RoHS Information
Buy Now

Device Overview

Summary

The TC1302A combines two Low Dropout (LDO) regulators into a single 8-pin MSOP or DFN package. Both regulator ouputs feature low dropout voltage, 104 mV @ 300 mA for Vout1, 150 mV @ 150 mA for Vout2, low quiescent current consumption, 58 µA each and a typical regulation accuracy of 0.5%. Several fixed-output voltage combinations are available. A reference bypass pin is available to further reduce output noise and improve the power supply rejection ratio of both LDOs.

Additional Features
    • Dual Output LDO
    • Low Dropout Voltage
    • Low Supply Current: 116 µA Typical
    • Reference Bypass Input for Low-Noise Operation
    • Overtemperature adn Overcurrent Protection
Parametrics
Name
Value
Product Type
Single LDOs
# of Out
2
IOUT #1
300
IOUT #2
150
IOUT #3
n/a
IOUT #4
n/a
IOUT (mA)
300
VIN Min (V)
2.7
VIN Max (V)
6
VOUT (V)
1.5 - 3.3
Voltage Drop Typ (mV)
150
IGND Typ (µA)
103
Tol Typ %
±0.5
PSRR 1 kHz (dB)
58
Soft Start Pin
Load Dump
Rev Bat
Reverse Current Protect

Documents

Jump to:

Data Sheet

02/05/2013
503KB

Product Line Card

Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

Learn More
Add To Cart

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
TC1302A-APVUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-APVUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-DTVUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-DTVUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-HPVUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-HPVUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-IPVUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-IPVUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1302A-DTVMF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-DTVMFTR
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-FFVMF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-FFVMFTR
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-HPVMF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-HPVMFTR
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-IAVMF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-IAVMFTR
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-IPVMF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-IPVMFTR
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-ISVMF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
TC1302A-ISVMFTR
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

Buy from the Microchip Store

Grid
View
Table
View
Filter:
Apply
Clear
Only show products with samples
Product
Leads
Package Type
Temp Range
Packing Media
5K Pricing
Buy