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TC1269

300mA CMOS LDO w/ Shutdown and Vref Bypass

Status: In Production

Features:

  • Very Low Ground Current for Longer Battery Life
  • Very Low Dropout Voltage
  • High Output Voltage Accuracy
  • Standard or Custom Output Voltages
  • Power-Saving Shutdown Mode
  • Bypass Input for Ultra-Quiet Operation
  • Over-Current and Over-Temperature Protection
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The TC1269 is a fixed output, high accuracy (typically ±0.5%) CMOS upgrade for older (bipolar) low dropout regulators. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). TC1269 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load), and fast response to step changes in load. Supply current is reduced to 0.05µA (typical) and VOUT falls to zero when the shutdown input is low. The TC1269 incorporates both over-temperature and over-current protection. The TC1269 is stable with an output capacitor of only 1µF and has a maximum output current of 300mA.

Additional Features
    • Very Low Ground Current for Longer Battery Life
    • Very Low Dropout Voltage
    • High Output Voltage Accuracy
    • Standard or Custom Output Voltages
    • Power-Saving Shutdown Mode
    • Bypass Input for Ultra-Quiet Operation
    • Over-Current and Over-Temperature Protection
Parametrics
Name
Value
Product Type
Single LDOs
# of Out
1
IOUT #1
300
IOUT #2
n/a
IOUT #3
n/a
IOUT #4
n/a
IOUT (mA)
300
VIN Min (V)
2.7
VIN Max (V)
6
VOUT (V)
2.5 2.8 3.0 3.3 5.0
Voltage Drop Typ (mV)
240
IGND Typ (µA)
50
Tol Typ %
±0.5
PSRR 1 kHz (dB)
50
Soft Start Pin
Load Dump
Rev Bat
Reverse Current Protect

Documents

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Data Sheet

02/05/2013
186KB

Product Line Card

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
TC1269-2.5VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1269-2.5VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1269-2.7VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1269-2.7VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1269-2.8VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1269-2.8VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1269-3.0VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1269-3.0VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1269-3.3VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1269-3.3VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1269-5.0VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1269-5.0VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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