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TC1174

300mA CMOS LDO with Shutdown and Vref Bypass

Status: In Production

Features:

  • Low Supply Current of 50 µA typical
  • Very Low Dropout Voltage
  • Minimum 300mA Output Current
  • Adjustable Output Voltage
  • Power-Saving Shutdown Mode
  • Bypass Input for Ultra-Quiet Operation
  • Over-Current and Over-Temperature Protection
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The TC1174 is an adjustable output CMOS low dropout regulator. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). TC1174 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load) and internal feed-forward compensation for fast response to step changes in load. Supply current is reduced to 0.05µA (typical) and VOUT falls to zero when the shutdown input is low. The TC1174 incorporates both over-temperature and over-current protection. The TC1174 is stable with an output capacitor of only 1µF and has a maximum output current of 300mA.

Additional Features
    • Low Supply Current of 50 µA typical
    • Very Low Dropout Voltage
    • Minimum 300mA Output Current
    • Adjustable Output Voltage
    • Power-Saving Shutdown Mode
    • Bypass Input for Ultra-Quiet Operation
    • Over-Current and Over-Temperature Protection
Parametrics
Name
Value
Product Type
Single LDOs
# of Out
1
IOUT #1
300
IOUT #2
n/a
IOUT #3
n/a
IOUT #4
n/a
IOUT (mA)
300
VIN Min (V)
2.7
VIN Max (V)
6
VOUT (V)
1.23 - 5.5
Voltage Drop Typ (mV)
270
IGND Typ (µA)
50
Tol Typ %
PSRR 1 kHz (dB)
60
Soft Start Pin
Load Dump
Rev Bat
Reverse Current Protect

Documents

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Data Sheet

02/05/2013
199KB

Product Line Card

Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
TC1174VUAMR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1174VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
TC1174VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
TC1174VOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
TC1174VOATR
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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