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PM8617

Flashtec NVMe 8xG3 PCIe Flash Controller

Status: In Production

Features:

  • Up to 500K random read IOPS on 4KB operations
  • 8 independent 8-bit Flash channels, each supporting up to eight targets
  • Up to 16GB of DDR4 SDRAM (assuming x8 DDR4 8Gb components)
  • SLC, MLC, TLC and QLC flash with Toggle and ONFI interfaces
  • PCIe Gen 3 x4 or dual independent PCIe Gen 3 x2 (active/ active or active/standby) host interface
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The Flashtec NVMe 2108 controller supports the standard NVM Express (NVMe) host interface, and is optimized for high-performance 4 KB random read/write operations, performing all flash management operations on-chip and consuming negligible host processing and memory resources. Advanced ECC enables current and future architectures with next-generation NAND technologies, and programmable architecture enables SSD product differentiation through firmware customization. Up to 16 GB of DDR4 with 8 Gb components is supported and controllers support the popular 2.5" and M.2 form factors. Flashtec controllers support the industry’s highest mainstream capacity SSD solutions, optimized for enterprise and data center workloads.

Additional Features
  • Up to 500K random read IOPS on 4KB operations
  • 8 independent 8-bit Flash channels, each supporting up to eight targets
  • Up to 16GB of DDR4 SDRAM (assuming x8 DDR4 8Gb components)
  • SLC, MLC, TLC and QLC flash with Toggle and ONFI interfaces
  • PCIe Gen 3 x4 or dual independent PCIe Gen 3 x2 (active/ active or active/standby) host interface
  • High performance PCIe® Flash controllers optimized for enterprise and data center workloads
  • Advanced ECC enables current and future architectures with next-generation NAND technologies
  • Up to 16 GB of DDR4 SDRAM (assuming x8 DDR4 8 Gb components)
    • Programmable architecture enables SSD developers to optimize product differentiation through firmware customization
    • Supports industry’s highest capacity SSD solutions
    • Standard Enterprise NVMe host control interface
    • Encryption (XTS-AES-256 as defined in the IEEE P1619 specification)
    • Integrated temperature sensing diode. For optimal temperature results, use a remote temperature sensing product that supports resistance cancellation and beta compensation features, such as a Texas Instruments TMP421YZDT
    • Power fault and abrupt shutdown without data loss or corruption
    • Programmable architecture enables SSD developers to control product differentiation through firmware customization
    • Configurable data rate (DDR4 up to DDR4-2133)
    • 16-bit (with embedded ECC) data path with one rank
    • Supports x8 and x16 SDRAM data widths
  • Data integrity and reliability
    • Strong flash ECC
    • Internal data path protection
    • SECDED ECC on all internal RAMs and DDR4 SDRAM
    • End-to-end host to flash data protection
Parametrics
Name
Value
Channels
8 NAND channels (8 CE)
Flash Memory Capacity
16 TB
Performance
500K+ RR IOPS (4KB)
Host Bus Interface
PCIe Gen 3 x4 or dual PCIe Gen3 x2
System Memory
DDR4-2133

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Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PM8633A1-F3EI
0.000000
2.177778
623
FBGA
17x17x1.72mm
SAC305
e1
PM8632A1-F3EI
0.000000
2.177778
623
FBGA
17x17x1.72mm
SAC305
e1
PM8630A1-F3EI
0.000000
2.177778
623
FBGA
17x17x1.72mm
SAC305
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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