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PIC12F617

Status: In Production

Features:

  • Self Read-Write Flash Program Memory
  • Internal 4/8MHz oscillator
  • Comparator with hysterisis (user configurable)
  • Mid-Range core with 35 Instruction, 8 Stack Levels
  • 25mA Source/Sink current I/O
  • Two 8-bit Timer (TMR0/TMR2)
  • One 16-bit Timer (TMR1)
  • Watchdog Timer (WDT)
  • Enhanced Power-On/Off-Reset
  • Brown-Out Reset (BOR)
  • In Circuit Serial Programming (ICSP)
  • Enhanced Capture Compare PWM (Pulse Width Modulation)
  • Wide Operating Voltage (2.0V – 5.5V)
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Additional Features
    • Self Read-Write Flash Program Memory
    • Internal 4/8MHz oscillator
    • Comparator with hysterisis (user configurable)
    • Mid-Range core with 35 Instruction, 8 Stack Levels
    • 25mA Source/Sink current I/O
    • Two 8-bit Timer (TMR0/TMR2)
    • One 16-bit Timer (TMR1)
    • Watchdog Timer (WDT)
    • Enhanced Power-On/Off-Reset
    • Brown-Out Reset (BOR)
    • In Circuit Serial Programming (ICSP)
    • Enhanced Capture Compare PWM (Pulse Width Modulation)
    • Wide Operating Voltage (2.0V – 5.5V)
Parametrics
Name
Value
Program Memory Type
Flash
Program Memory Size (KB)
3.5
CPU Speed (MIPS/DMIPS)
5
SRAM Bytes
128
Capture/Compare/PWM Peripherals
1 ECCP,
Timers
2 x 8-bit, 1 x 16-bit
ADC Input
4 ch, 10-bit
Number of Comparators
1
Temperature Range (C)
-40 to 125
Operating Voltage Range (V)
2 to 5.5
Pin Count
8

Documents

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Development Environment

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Programmers
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  • Socket: AC164301   PartNo: PIC12F617 (8P)
  • Socket: AC164302   PartNo: PIC12F617 (8SN)
  • Socket: AC164325   PartNo: PIC12F617 (8MS)
  • Socket: AC164340   PartNo: PIC12F617 (8MF)
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 The MPLAB ICD 3 is a mature product. For new designs, consider using the MPLAB ICD 4 (DV164045)

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(Not Recommended for new design)

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC12F617-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
PIC12F617-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
PIC12F617T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-I/SN060
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617-E/SNVAO
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617-I/SNVAO
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-I/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-I/SN062
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617-I/SN
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617-E/SN
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-I/SN070
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-I/SN073
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617T-I/SN074
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC12F617-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
PIC12F617-E/MSVAO
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
PIC12F617T-E/MSVAO
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
PIC12F617T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
PIC12F617-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
PIC12F617T-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
PIC12F617T-E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
PIC12F617T-I/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
PIC12F617-E/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
PIC12F617-I/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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