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MCP607

Status: In Production

Features:

  • Low Input Offset Voltage: 250 µV (max.)
  • Rail-to-Rail Output
  • Low Input Bias Current: 1 pA (typ.)
  • Low Quiescent Current: 25 µA (max.)
  • Power Supply Voltage: 2.5V to 6.0V
  • Unity-Gain Stable
  • Industrial Temperature Range: -40°C to +85°C
  • AEC-Q100 Grade 1
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The MCP607 dual operational amplifier (op amp) has a gain bandwidth product of 155 kHz with a low typical operating current of 18.7 and an offset voltage that is less than 250 µV. The MCP607 uses Microchip's advanced CMOS technology, which provides low bias current, high-speed operation, high open-loop gain and rail-to-rail output swing. The MCP607 operates with a single supply voltage that can be as low as 2.5V, while drawing less than 25 of quiescent current per amplifier. The MCP607 is available in standard 8-lead PDIP, SOIC and TSSOP packages. This amplifier is ideal for battery and loop-powered applications as well as industrial process control, low-power battery-operated devices, portable equipment, data acquisition equipment, test equipment and low-end audio applications. AEC-Q100 Grade 1 qualification is available for this device

Additional Features
    • Low Input Offset Voltage: 250 µV (max.)
    • Rail-to-Rail Output
    • Low Input Bias Current: 1 pA (typ.)
    • Low Quiescent Current: 25 µA (max.)
    • Power Supply Voltage: 2.5V to 6.0V
    • Unity-Gain Stable
    • Industrial Temperature Range: -40°C to +85°C
    • AEC-Q100 Grade 1
Parametrics
Name
Value
Temp. Range (°C)
-40°C to +85°C
Vos Max (µV)
250
# per Package
2
Iq Typical (µA)
19
Iq Max (µA)
25
GBWP (kHz)
155
Operating Voltage Range (V)
2.5 to 6.0
Device Description
Linear Op Amps
Input Voltage Noise Density (nV/rt(Hz))
38
PSRR Min (dB)
80
CMRR Min (dB)
75
Vos/Ta (uV/°C)
1.8
Ib (pA)
1
Aol (dB)
118
PM (deg)
62
Isc (mA)
17
Rail-to-Rail
Out
Unity Gain Stable
Yes
Slew Rate V/uS
0.08

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Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
MCP6SX2 PGA Photo Diode PICtail Demo Board
MCP6SX2 PGA Photo Diode PICtail Demo Board ( MCP6SX2DM-PCTLPD )
(Not Recommended for new design)

The MCP6SX2 PGA Photodiode PICtail™ Demo Board features a PNZ334 photodiode, MCP6001U op amp, and MCP6S22 and MCP6S92 Programmable Gain Amplifiers (PGA).

The op amp converts the photodiode’s output current to voltage (transimpedance amplifier). Its output goes to one of the PGA’s inputs. The other PGA input is available for any other desired source. This opens the...

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MCP6S22 PGA Thermistor PICtail Demo Board
MCP6S22 PGA Thermistor PICtail Demo Board ( MCP6SX2DM-PCTLTH )

The MCP6SX2 PGA Thermistor PICtail Demo Board features the MCP6S22 and MCP6S92 Programmable Gain Amplifiers (PGA). These devices help:

  • Overcome the non-linear response of the on-board NTC thermistor
  • Provide multiplexing between two inputs; the other input can be any desired source. This opens the possibilities of temperature correcting another sensor,
...

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Add To Cart
Humidity Sensor PICtail Demo Bd
Humidity Sensor PICtail Demo Bd ( PIC16F690DM-PCTLHS )

This board supports the capacitive humidity sensor application note AN1016. It measures the capacitance of a relative humidity sensor plugged into the board. The on-board microcontroller sends the measured and calculated relative humidity (RH) to a PC for display.

The board can also measure small capacitors in different ranges of values using a dual slope integration method. The...

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Add To Cart
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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Add To Cart

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP6071T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
MCP6072T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
MCP6074-E/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
MCP6074T-E/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
MCP607-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
MCP607T-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
MCP6071-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP6071T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP6072-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP6072T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP6072T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP607-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP607T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP6074-E/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP6074T-E/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP6071T-E/OT
0.017000
0.066667
5
SOT-23
 
Matte Tin
e3
MCP6071T-E/OTVAO
0.017000
0.066667
5
SOT-23
 
Matte Tin
e3
MCP607-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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