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MCP14E10

3.0A Dual High-Speed Power MOSFET Driver with Enable

Status: In Production

Features:

  • High peak output Current: 3A (typ)
  • Independent Enable Function for each Driver
  • Low Shoot-Through/Cross-Conduction Current in output Stage
  • Wide input supply Operating Range: 4.5v to 18V
  • High Capacitive Load drive Capability: 1800 pF in 20nsec (typ)
  • Short Delay Times: 75nsec(typ)
  • Matched rise/fall Times
  • Low output Impedance: 2.2Ω (typ)
  • Latch-up Protected: Will withstand 1.5A Reverse Current
  • Input are TTL/CMOS compatiple and will withstand negative swings Up To 5V
  • ESD Protected: 4kV
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The MCP14E9/E10/E11 devices are a family of 3A,dual output buffers/MOSFET drivers with seperate enable functions for each output. As MOSFET drivers, the MCP14E9/E10/E11 can charge 1800 pF gate capacitance in under 25 nsec (max).The inputs are TTL/CMOS compatible and provide 300 mV of hysteresis between the high and low input levels that allows it to be driven from slow rising and falling signals and provide noise immunity.

Additional Features
    • High peak output Current: 3A (typ)
    • Independent Enable Function for each Driver
    • Low Shoot-Through/Cross-Conduction Current in output Stage
    • Wide input supply Operating Range: 4.5v to 18V
    • High Capacitive Load drive Capability: 1800 pF in 20nsec (typ)
    • Short Delay Times: 75nsec(typ)
    • Matched rise/fall Times
    • Low output Impedance: 2.2Ω (typ)
    • Latch-up Protected: Will withstand 1.5A Reverse Current
    • Input are TTL/CMOS compatiple and will withstand negative swings Up To 5V
    • ESD Protected: 4kV
Parametrics
Name
Value
MOSFET Driver Type
Low Side
Driver Type
Dual
Configuration
Non-inverting
Peak Output Current (source/sink, A)
3.0/3.0
Output Resistance (source/sink, Ω)
4/4
Maximum Supply Voltage (V)
18
Propagation Delay (Td1/Td2, ns)
45/45
Rise/Fall Time (Tr/Tf, ns)
14/17
Capacitive Load Drive
1800 pF in 17 ns
Features
Enable pin

Documents

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Data Sheets

  
783KB

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP14E10T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14E10-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14E10-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP14E10-E/MF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
MCP14E10T-E/MF
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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