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HV56020

Dual 250V Haptic Drive Amp Array w/Boost

Status: In Production

Features:

  • Dual 250V Operational Amplifiers
  • HVout to 225V, Iout to 40mA Min (Source/Sink)
  • Vout Comparators for OCP (- 124 Hz –3 dB BW w/0.22 μF Cload
  • Integrated Flyback Converter (VIN: 2.7V to 5.5V, Vout: Typ 250V Max)
  • 3-Bit DAC for Boost Output Control (Minimize Pdiss vs. Drive Waveform)
  • Integrated Protection Features: OVP, UVP, OCP
  • Temperature Sensor
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Overview
Documents
Development Environment
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RoHS Information
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Device Overview

Summary

The HV56020 is a dual amplifier with integrated boost for driving piezo actuators for haptic applications, such as Kemet film actuators, and other solutions.    The HV56020 comes with 3 functions, specifically, dual 250V operational amplifiers, a boost controller, and a power MOSFET. The opamps are designed to drive haptic (piezo) actuators at 225V with 40 mA minimum source/sink current. The boost controller and power MOSFET along with an external transformer generate the voltage supply for the HV opamps using a non-Isolated flyback configuration.

The HV56020 is the master IC between the HV56020 and HV56022, with the inclusion of the boost converter versus simply the dual amplifier array of the HV56022.  The drive channel count is supportable by expanding with additional HV56020s if additional power is required for simultaneous drive of multiple channels (beyond two,) or with HV56022s if the additional channels can be driven time-sliced versus those drawing power from the first HV56020 boost converter. The HV56020 also includes a variety of protection features, including Over/Under Voltage Protection, Output Short Circuit Protection (DC-to-DC), Temperature Sensor and Output Voltage Comparators for load Short Circuit Detection.

PLEASE CONTACT YOUR LOCAL MICROCHIP SALES OFFICE FOR PRODUCT SAMPLE AVAILABILITY.

Microchip has partnered with Kemet (previously Novasentis Inc.) to create this chipset that optimizes size and features for driving thin-film actuators that enable haptic applications in various hard and soft goods. Learn more >>

Additional Features
  • Dual 250V Operational Amplifiers
  • HVout to 225V, Iout to 40mA Min (Source/Sink)
  • Vout Comparators for OCP (- 124 Hz –3 dB BW w/0.22 μF Cload
  • Integrated Flyback Converter (VIN: 2.7V to 5.5V, Vout: Typ 250V Max)
  • 3-Bit DAC for Boost Output Control (Minimize Pdiss vs. Drive Waveform)
  • Integrated FET (Vdss,Max 60V, Rds,on 10mΩ Max, 25°C)
  • Integrated Protection Features: OVP, UVP, OCP
  • Stand-By Mode (Min Current Mode)
  • Temperature Sensor
  • Power-On Reset
  • 24 MHz SPI Interface
  • 43-Ld. 7mm x 7mm VQFN, 0.9mm Thick
Parametrics
Name
Value
Slew Rate (V/µs)
0.2
Closed Loop Gain (V/V)
75
Feedback Resistance (M Ω)
1.9
HVOUT Source max (µA)
96000
HVOUT Sink max (µA)
167000
HVOUT Capacitive Load max (pF)
N/A
Output Current Limit
OCP Flag to Host Micro
Package
43-Ld. 7mmx7mm VQFN

Documents

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Data Sheets

  
886KB

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
HV56020T-V/KXX
0.000000
0.366667
43
VQFN
7x7x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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