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ATSAM3X4E

Status: Not Recommended for new designs

Features:

  • ARM Cortex-M3 revision 2.0 running at up to 84 MHz
  • Memory Protection Unit (MPU)
  • 24-bit SysTick Counter
  • Thumb®-2 instruction set
  • Nested Vector Interrupt Controller
  • 2 x 128 Kbytes embedded Flash, 128-bit wide access, memory accelerator, dual bank
  • 2 x 32 Kbytes embedded SRAM with dual banks
  • 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines
  • Static Memory Controller (SMC): SRAM, NOR, NAND support.
  • NAND Flash controller with 4 Kbytes RAM buffer and ECC
  • External Bus Interface - 16 bits, 8 chip selects, 23-bit address
  • Embedded voltage regulator for single-supply operation
  • POR, BOD and Watchdog for safe reset
  • Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768 kHz for RTC or device clock
  • High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default Frequency for fast device startup
  • Slow Clock Internal RC oscillator as permanent clock for device clock in low power mode
  • One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Mini Host/Device
  • Temperature Sensor
  • 17 peripheral DMA (PDC) channels and 6-channel central DMA plus dedicated DMA for High-Speed USB Mini Host/Device and Ethernet MAC
  • Sleep, Wait and Backup modes, down to 2.5 μA in Backup mode with RTC, RTT, and GPBR
  • 144-lead LQFP – 20 x 20 mm, pitch 0.5 mm
  • 144-ball LFBGA – 10 x 10 mm, pitch 0.8 mm
  • Industrial (-40° C to +85° C)
  • USB 2.0 Device/Mini Host: 480 Mbps, 4 Kbyte FIFO, up to 10 bidirectional Endpoints, dedicated DMA
  • 4 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester and LIN support) and one UART
  • 2 TWI (I2C compatible), up to 6 SPIs, 1 SSC (I2S), 1 HSMCI (SDIO/SD/MMC) with up to 2 slots
  • 9-channel 32-bit Timer Counter (TC) for capture, compare and PWM mode, Quadrature Decoder Logic and 2-bit Gray Up/Down Counter for Stepper Motor
  • 32-bit low-power Real-time Timer (RTT) and low-power Real-time Clock (RTC) with calendar and alarm features
  • 256-bit General Purpose Backup Registers (GPBR)
  • Ethernet MAC 10/100 (EMAC - MII/RMII) with dedicated DMA
  • 2 CAN Controllers with 8 Mailboxes
  • True Random Number Generator (TRNG)
  • 103 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination
  • Six 32-bit Parallel Input/Output Controllers
  • 16-channel 12-bit 1 msps ADC with differential input mode and programmable gain stage
  • 2-channel 12-bit 1 msps DAC
  • Serial Wire/JTAG Debug Port(SWJ-DP)
  • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.
  • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.
  • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.
  • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.
  • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.
  • IEEE1149.1 JTAG Boundary-scan on all digital pins.
  • ASF-Atmel software Framework – SAM software development framework
  • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.
  • DMA support, Interrupt handlers Driver support
  • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks
  • RTOS integration, FreeRTOS is a core component
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Overview
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Development Environment
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RoHS Information
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Device Overview

Summary

Based on the ARM® Cortex®-M3 processor, the Microchip's SAM3X4E runs at 84MHz and features 256KB of flash memory in 2 x 128KB banks and 68KB of SRAM in 2 x 32KB banks, with an additional 4KB as NFC (NAND Flash controller) SRAM.

Its highly-integrated peripheral set includes Ethernet, dual CAN, High Speed USB MiniHost and device with on-chip PHY, high-speed SD/SDIO/MMC, and multiple USARTs, SPIs, TWIs (I2C), and one I2S. The SAM3X4E also features a 12-bit ADC/DAC, temperature sensor, 32-bit timers, PWM timer and RTC.

The 16-bit external bus interface supports SRAM, PSRAM, NOR and NAND Flash with error code correction.

The Microchip QTouch Library is available for the SAM3X4E for easy implementation of buttons, sliders and wheels.

The device operates from 1.62V to 3.6V and is available in 144-pin QFP and BGA packages.

Additional Features

    Microcontroller Features

    Core

    • ARM Cortex-M3 revision 2.0 running at up to 84 MHz

    • Memory Protection Unit (MPU)

    • 24-bit SysTick Counter

    • Thumb®-2 instruction set

    • Nested Vector Interrupt Controller

    Memories

    • 2 x 128 Kbytes embedded Flash, 128-bit wide access, memory accelerator, dual bank

    • 2 x 32 Kbytes embedded SRAM with dual banks

    • 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines

    • Static Memory Controller (SMC): SRAM, NOR, NAND support.

    • NAND Flash controller with 4 Kbytes RAM buffer and ECC

    • External Bus Interface - 16 bits, 8 chip selects, 23-bit address

    System

    • Embedded voltage regulator for single-supply operation

    • POR, BOD and Watchdog for safe reset

    • Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768 kHz for RTC or device clock

    • High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default Frequency for fast device startup

    • Slow Clock Internal RC oscillator as permanent clock for device clock in low power mode

    • One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Mini Host/Device

    • Temperature Sensor

    • 17 peripheral DMA (PDC) channels and 6-channel central DMA plus dedicated DMA for High-Speed USB Mini Host/Device and Ethernet MAC

    Low Power modes

    • Sleep, Wait and Backup modes, down to 2.5 μA in Backup mode with RTC, RTT, and GPBR

    Package

    • 144-lead LQFP – 20 x 20 mm, pitch 0.5 mm

    • 144-ball LFBGA – 10 x 10 mm, pitch 0.8 mm

    Temperature operating range

    • Industrial (-40° C to +85° C)

    Peripheral Features

    • USB 2.0 Device/Mini Host: 480 Mbps, 4 Kbyte FIFO, up to 10 bidirectional Endpoints, dedicated DMA

    • 4 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester and LIN support) and one UART

    • 2 TWI (I2C compatible), up to 6 SPIs, 1 SSC (I2S), 1 HSMCI (SDIO/SD/MMC) with up to 2 slots

    • 9-channel 32-bit Timer Counter (TC) for capture, compare and PWM mode, Quadrature Decoder Logic and 2-bit Gray Up/Down Counter for Stepper Motor

    • 32-bit low-power Real-time Timer (RTT) and low-power Real-time Clock (RTC) with calendar and alarm features

    • 256-bit General Purpose Backup Registers (GPBR)

    • Ethernet MAC 10/100 (EMAC - MII/RMII) with dedicated DMA

    • 2 CAN Controllers with 8 Mailboxes

    • True Random Number Generator (TRNG)

    I/O

    • 103 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination

    • Six 32-bit Parallel Input/Output Controllers

    Analog Features

    • 16-channel 12-bit 1 msps ADC with differential input mode and programmable gain stage

    • 2-channel 12-bit 1 msps DAC

    Debugger Development Support

    • Serial Wire/JTAG Debug Port(SWJ-DP)

    • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.

    • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.

    • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.

    • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.

    • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.

    • IEEE1149.1 JTAG Boundary-scan on all digital pins.

    Integrated Software Libraries and Tools

    • ASF-Atmel software Framework – SAM software development framework

    • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.

    • DMA support, Interrupt handlers Driver support

    • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks

    • RTOS integration, FreeRTOS is a core component

Parametrics
Name
Value
Part Family
ATSAM3X4E
Max CPU Speed MHz
84
Program Memory Size (KB)
256
SRAM (KB)
64
SDIO/SD-CARD/eMMC
1
Temperature Range (C)
-40 to 85
Operating Voltage Range (V)
1.62 to 3.6
Direct Memory Access Channels
23
SPI
4
I2C
2
Peripheral Pin Select / Pin Muxing
Yes
Ethernet
10/100 Base-TX Mac
Number of USB Modules
1
Number of CAN modules
2
ADC Input
16
Max ADC Resolution (Bits)
12
Max ADC Sampling Rate (ksps)
1000
Number of DACs
1
Input Capture
6
Parallel Port
EBI
Internal Oscillator
4,8,12Mhz,32Khz
Hardware RTCC/RTC
Yes
Max I/O Pins
103
Pincount
144
Quadrature Encoder Interface
2

Documents

Jump to:

Data Sheet

03/01/2015
5965KB

Application Notes

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Product Document

White Papers

05/01/2013
443KB

Development Environment

  • Demo & Evaluation Boards
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATSAM3X4EA-AU
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
ATSAM3X4EA-CU
0.214700
1.130435
144
LFBGA
10x10x1.4mm
LF35
e8
ATSAM3X4EA-CUR
0.214700
0.217000
144
LFBGA
10x10x1.4mm
LF35
e8
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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