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PIC18F26K83

Status: In Production

Features:

  • Supports CAN 1.2, 2.0A and 2.0B
  • Six modes of operation
  • Supports legacy - Fully backward compatibly 
  • Interrupt Vector Table
  • Programmable single or dual priority
  • Two level hardware context saving
  • Eliminates need for CPU involvement in data transfers
  • Access to all memory spaces and peripherals
  • Flexible source and destination message sizes
  • Programmable DMA priority 
  • Memory Access Partition (MAP) - Customize flash partitioning with bootloader write protection
  • Device Information Area (DIA) - Dedicated memory area for data storage of temp sensor factory calibration value, factory ID and  FVR values for ADC and COMP
  • WDT: 500nA @ 1.8V typical
  • SLEEP mode: 50nA @ 1.8V typical 
  • DOZE mode allows CPU to run at a lower clock speed than peripherals
  • IDLE and SLEEP modes selectively shut down peripherals and/or core for power reduction
  • Automates math functions on input signals:
  • Averaging, filter calculations, oversampling and threshold comparison
  • Hardware Capacitive Voltage Divider (CVD)
  • Automates touch sampling and reduces software size and CPU usage when touch or proximity sensing is required
  • 5-bit resolution, rail-to-rail 
  • Unbuffered I/O pin output
  • Comparator hysteresis enable 
  • Invert output polarity
  • Fixed Voltage Reference (FVR) module - 1.024V, 2.048V and 4.096V output levels
  • Senses high voltage AC signal
  • Generates interrupts on zero cross
  • DMA compatible
  • Asynchronous UART, RS-232, RS-485 compatible
  • Programmable 1, 1.5, 2 stop bits
  • Configurable length bytes
  • Arbitrary length data packets
  • Separate transmit and receive buffers with 2-byte FIFO and DMA capabilities
  • SMBus, PMBUSTM compatible
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Overview
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Device Overview

Summary

The PIC18(L)F25/26K83 microcontroller family with CANTM technology in 28-pins features a 12-bit ADC with Computation (ADC2) automating Capacitive Voltage Divider (CVD) techniques for advanced touch sensing, averaging, filtering, oversampling and threshold comparison. In addition, the product family includes Vectored Interrupt Controller with fixed latency for handling interrupts, System Bus Arbiter, Direct Memory Access capabilities, UART with support for Asynchronous DMX, DALI and LIN transmissions, SPI, I2C, memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.

Additional Features

     

    CONTROLLER AREA NETWORK MODULE (CAN)                                            

    • Supports CAN 1.2, 2.0A and 2.0B
    • Six modes of operation
    • Supports legacy - Fully backward compatibly 

    LOW POWER & SYSTEM FLEXIBILITY

    • Vectored Interrupt (VI) capability - Faster interrupt response time
      • Interrupt Vector Table
      • Programmable single or dual priority
      • Two level hardware context saving
    • Direct Memory Access (DMA) controllers - Move data between without CPU
      • Eliminates need for CPU involvement in data transfers
      • Access to all memory spaces and peripherals
      • Flexible source and destination message sizes
      • Programmable DMA priority 
    • Memory Access Partition (MAP) - Customize flash partitioning with bootloader write protection
    • Device Information Area (DIA) - Dedicated memory area for data storage of temp sensor factory calibration value, factory ID and  FVR values for ADC and COMP
    • eXtreme Low Power (XLP) technology - Industry leading low power technology
      • WDT: 500nA @ 1.8V typical
      • SLEEP mode: 50nA @ 1.8V typical 
      • DOZE mode allows CPU to run at a lower clock speed than peripherals
      • IDLE and SLEEP modes selectively shut down peripherals and/or core for power reduction

    INTELLIGENT ANALOG

    • 12-bit Analog to Digital (ADC2) with Computation
      • Automates math functions on input signals:
      • Averaging, filter calculations, oversampling and threshold comparison
      • Hardware Capacitive Voltage Divider (CVD)
      • Automates touch sampling and reduces software size and CPU usage when touch or proximity sensing is required
    • 5-bit Digital to Analog Converter (DAC)
      • 5-bit resolution, rail-to-rail 
      • Unbuffered I/O pin output
    • 2 x Comparators
      • Comparator hysteresis enable 
      • Invert output polarity
    • Fixed Voltage Reference (FVR) module - 1.024V, 2.048V and 4.096V output levels
    • Zero-Cross Detection
      • Senses high voltage AC signal
      • Generates interrupts on zero cross

      COMMMUNICATIONS

    • 2 x UART - One UART supports LIN/DMX/DALI
      • DMA compatible
      • Asynchronous UART, RS-232, RS-485 compatible
      • Programmable 1, 1.5, 2 stop bits
    • SPI: 
      • Configurable length bytes
      • Arbitrary length data packets
      • Separate transmit and receive buffers with 2-byte FIFO and DMA capabilities
    • 2 x I2C:
      • SMBus, PMBUSTM compatible
Parametrics
Name
Value
Program Memory Type
Flash
Program Memory Size (KB)
64
CPU Speed (MIPS/DMIPS)
16
SRAM (B)
4,096
Data EEPROM/HEF (bytes)
1024
Digital Communication Peripherals
2-UART, 1-SPI, 1-I2C
Capture/Compare/PWM Peripherals
4 CCP,
Timers
3 x 8-bit, 4 x 16-bit
ADC Input
24 ch, 12-bit
Number of Comparators
2
Number of CAN Modules
1 CAN
Temperature Range (°C)
-40 to 125
Operating Voltage Range (V)
1.8 to 5.5
Pin Count
28
Low Power
Yes

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Price 5K
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2,048
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CAN, 12-bit ADC, vector interrupts, DMA
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC18F26K83-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
PIC18F26K83-I/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
PIC18F26K83T-I/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
PIC18LF26K83-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
PIC18LF26K83-I/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
PIC18LF26K83T-I/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
PIC18F26K83-E/MLVAO
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
PIC18F26K83-E/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
PIC18F26K83-I/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
PIC18F26K83T-I/MX
0.002900
0.181212
28
UQFN
6x6x0.5mm
Matte Tin
e3
PIC18LF26K83-E/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
PIC18LF26K83-I/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
PIC18LF26K83T-I/MX
0.002900
0.181212
28
UQFN
6x6x0.5mm
Matte Tin
e3
PIC18F26K83T-E/5NVAO
0.079600
0.332500
28
VQFN
6x6x1.0mm
Matte Tin
e3
PIC18F26K83-E/5NVAO
0.079600
0.163934
28
VQFN
6x6x1.0mm
Matte Tin
e3
PIC18F26K83-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
PIC18F26K83-E/SSVAO
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
PIC18F26K83-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
PIC18F26K83T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
PIC18LF26K83-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
PIC18LF26K83-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
PIC18LF26K83T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
PIC18F26K83T-I/SS020
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
PIC18F26K83-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC18F26K83-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC18F26K83T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC18LF26K83-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC18LF26K83-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC18LF26K83T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
PIC18F26K83-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC18F26K83-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC18LF26K83-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC18LF26K83-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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