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MCP2561FD

High-speed CAN FD Transceiver with Standby Mode and SPLIT Pin

Status: In Production

Features:

  • Maximum Propagation Delay: 120 ns
  • Loop Delay Symmetry: -10%/+10% (2 Mbps)
  • Implements ISO-11898-2 and ISO-11898-5 Standard Physical Layer Requirements
  • AEC-Q100 Grade 0
  • Very Low Standby Current (5 μA, typical)
  • VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5.5V I/O
  • SPLIT Output Pin to Stabilize Common Mode in Biased Split Termination Schemes
  • An Unpowered Node or Brown-Out Event will Not Load the CAN Bus
  • Permanent Dominant Detection on TXD
  • Permanent Dominant Detection on Bus
  • Power-on Reset and Voltage Brown-Out Protection on VDD Pin
  • Protection Against Damage Due to Short-Circuit Conditions (Positive or Negative Battery Voltage)
  • Protection Against High-Voltage Transients in Automotive Environments
  • Automatic Thermal Shutdown Protection
  • Suitable for 12V and 24V Systems
  • Radiated emissions @ 2 Mbps with Common Mode Choke (CMC)
  • DPI @ 2 Mbps with CMC
  • High ESD Protection on CANH and CANL, meeting IEC61000-4-2 up to ±14 kV
  • Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
  • Extended (E): -40°C to +125°C
  • High (H): -40°C to +150°C
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The MCP2561/2FD is a Microchip Technology Inc. second generation high-speed CAN transceiver. It offers the same features as the MCP2561/2. Additionally, it guarantees Loop Delay Symmetry in order to support the higher data rates required for CAN FD. The maximum propagation delay was improved to support longer bus length.
The device meets the automotive requirements for CAN FD bit rates exceeding 5 Mbps, low quiescent current, electromagnetic compatibility (EMC) and electrostatic discharge (ESD).  The device family members are MCP2561FD with SPLIT pin & MCP2562FD with VIO pin.

Additional Features

     

    • Optimized for CAN FD (Flexible Data rate) at 2, 5 and 8 Mbps Operation
      • Maximum Propagation Delay: 120 ns
      • Loop Delay Symmetry: -10%/+10% (2 Mbps)
    • Implements ISO-11898-2 and ISO-11898-5 Standard Physical Layer Requirements
    • AEC-Q100 Grade 0
    • Very Low Standby Current (5 μA, typical)
    • VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5.5V I/O
    • SPLIT Output Pin to Stabilize Common Mode in Biased Split Termination Schemes
    • CAN Bus Pins are Disconnected when Device is Unpowered
      • An Unpowered Node or Brown-Out Event will Not Load the CAN Bus
    • Detection of Ground Fault:
      • Permanent Dominant Detection on TXD
      • Permanent Dominant Detection on Bus
    • Power-on Reset and Voltage Brown-Out Protection on VDD Pin
    • Protection Against Damage Due to Short-Circuit Conditions (Positive or Negative Battery Voltage)
    • Protection Against High-Voltage Transients in Automotive Environments
    • Automatic Thermal Shutdown Protection
    • Suitable for 12V and 24V Systems
    • Meets or exceeds stringent automotive design requirements including “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”, Version 1.3, May 2012
      • Radiated emissions @ 2 Mbps with Common Mode Choke (CMC)
      • DPI @ 2 Mbps with CMC
    • High ESD Protection on CANH and CANL, meeting IEC61000-4-2 up to ±14 kV
    • Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
    • Temperature ranges:
      • Extended (E): -40°C to +125°C
      • High (H): -40°C to +150°C
Parametrics
Name
Value
Version Supported
Yes
Temp. Range (°C)
-40 to +150
Operating Voltage Range (V)
4.5 to 5.5

Documents

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP2561FD-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2561FD-H/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2561FDT-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2561FD-E/SN
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2561FD-H/SN
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2561FDT-H/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2561FD-H/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2561FD-E/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2561FDT-H/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2561FDT-E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
MCP2561FDT-H/MFVAO
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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