We offer high-value and high-quality Bluetooth® audio silicon and module solutions. They are compliant with the latest Bluetooth specifications and are proven for interoperability. Low power and small form factor with a built-in Bluetooth stack, our audio solutions provide excellent audio quality (SNR), sound level and sound effects (DSP). They also support digital audio, a variety of audio sources and value-added features such as support for multiple speakers and high-resolution Bluetooth audio with LDAC™ technology.
The IS2064 Bluetooth audio SoC supports LDAC technology and other audio codec interfaces. Sony's LDAC audio codec technology is considered the highest-quality audio codec available. It transmits up to 990 kbps data throughput, which is three times higher than the standard Bluetooth Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96 kHz/24-bit, allowing for High Resolution (Hi-Res) audio. Email BTAudio@Microchip.com for more information.
Typical Wireless Audio Applications
- Headsets
- Speakers
- Premium audio
- Audio with Bluetooth Low Energy
- Soundbars
- Gaming with audio/voice
- Smart home with audio/voice
Use these links to view block diagrams of specific Bluetooth audio applications:
Start adding Bluetooth connectivity to your application today. We have a plug-and-play development tool for each of its Bluetooth modules and silicon products to help you create prototypes quickly and easily.
Evaluation Kits
ATBTLC1000-XPRO-ADPT: This is an adapter board for the ATBTLC1000-XPRO expansion board.
BTLC1000 Xplained Pro Evaluation Kit: The BTLC1000 Xplained Pro Evaluation Kit is a hardware platform to evaluate the ATBTLC1000-MR110CA Bluetooth Low Energy module. The Xplained Pro extension board can be plugged into any of the supported host MCU Xplained Pro evaluation boards to quickly add Bluetooth Smart connectivity to an existing host MCU platform.
BTLC1000 Xplained Pro Starter Kit: The BTLC1000 Xplained Starter Kit is a hardware platform to evaluate the ATBTLC1000-MR110CA module with the SAM L21 Xplained Pro host MCU evaluation board. The Xplained Pro extension board plugs into the SAM L21 Xplained Pro evaluation board to quickly add Bluetooth Smart connectivity.
SAM B11 Xplained Pro Evaluation Kit: The SAM B11 Xplained Pro Evaluation Kit is a hardware platform to evaluate the ATSAMB11-MR510CA module for a complete Bluetooth Smart application on an Arm® Cortex-M0 based MCU.
Reference Designs
Ultra Low-Power Connected Demonstrator: This reference design features a SAM L21 MCU and the BTLC100 module to create IoT applications including wearables, smart tags and sensor automation.
- Silicon
- Modules
| Product | Status | Bluetooth Version | Temperature Range | Operation Voltage Range | Bluetooth Classic-Data/SPP | Bluetooth Classic-Audio | Bluetooth Low Energy | Audio Channels | Analog Audio Out | Digital Audio Out | MIC-in | Line-in | Integrated Class-D AMP | I2C | SPI | PWM | ADC Channels | Memory Type | GPIO | Pin Count | Package Type | Package Size | I2S | UART | Wireless Stereo Technology | Wireless Concert Technology | Audio Transceiver | Packages |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BM83 | In Production | 5.0 | -40C to +85C | 3.2VV - 4.2VV | Yes | Yes | Yes | Stereo | Yes | Yes | 2 | Yes | 1 | No | 1 | 2 | Flash | 18 | 0 | Module | 32 x 15 x 2.5 mm | Yes | Yes | No | Yes | Yes | 50/Module | |
| IS1678 | In Production | 5.0 | -20C to 70C | 3.2V - 4.3V | Yes | No | Yes | No | No | No | 0 | No | No | 1 | No | No | 0 | Flash/ROM | 16 | 40 | QFN | 6 x 6 mm | 0 | 40/VQFN | ||||
| IS1870 | In Production | 5.0 | -40 to +85C | 1.9V - 3.6V | No | No | Yes | No | No | No | 0 | No | No | 0 | No | 3 | 16 | Flash | 31 | 48 | QFN | 6 x 6 mm | 0 | 48/VQFN | ||||
| IS1871 | In Production | 5.0 | -40C to +85C | 1.9V - 3.6V | No | No | Yes | No | No | No | 0 | No | No | 0 | No | Yes | 6 | Flash | 15 | 32 | QFN | 4 x 4 mm | 0 | 32/VQFN | ||||
| IS2008 | In Production | 5.0 | -20C to 70C | 3.2V - 4.25V | Yes | Yes | No | Mono | Yes | No | 1 | No | No | 1 | No | No | 0 | ROM | 6 | 48 | QFN | 6 x 6 mm | 0 | 48/VQFN | ||||
| IS2010 | In Production | 5.0 | -20C to 70C | 3.2V - 4.25V | Yes | Yes | No | Mono | Yes | No | 2 | No | No | 1 | No | No | 0 | ROM | 6 | 48 | QFN | 6 x 6 mm | 0 | 48/VQFN | ||||
| IS2013 | In Production | 5.0 | -20C to 70C | 3.2V - 4.25V | No | Yes | No | Mono | Yes | No | 1 | Yes | Yes | 1 | No | No | 0 | ROM | 9 | 56 | QFN | 7 x 7 mm | 0 | 56/VQFN | ||||
| IS2015 | In Production | 5.0 | -20C to 70C | 3.2V - 4.25V | Yes | Yes | No | Mono | Yes | No | 1 | Yes | Yes | 1 | No | No | 0 | ROM | 9 | 56 | QFN | 7 x 7 mm | 0 | 56/VQFN | ||||
| IS2020 | In Production | 5.0 | -20C to 70C | 3.0V - 4.25V | Yes | Yes | No | Stereo | Yes | No | 2 | Yes | No | 1 | No | No | 0 | ROM | 9 | 56 | QFN | 7 x 7 mm | 0 | 56/VQFN | ||||
| IS2021 | Mature Product | 5.0 | -20C to 70C | 3.0V - 4.25V | Yes | Yes | No | Stereo | Yes | No | 1 | No | No | 1 | No | No | 0 | ROM | 8 | 48 | QFN | 5 x 6.5 mm | 0 | 48/VQFN | ||||
| IS2022 | In Production | 5.0 | -20C to 70C | 3.0V - 4.25V | Yes | Yes | No | Stereo | Yes | No | 1 | No | No | 1 | No | No | 0 | ROM | 9 | 48 | QFN | 6 x 6 mm | 48/VQFN | |||||
| IS2023 | In Production | 5.0 | -20C to 70C | 3.0V - 4.25V | Yes | Yes | No | Stereo | No | Yes | 1 | Yes | No | 1 | No | No | 0 | ROM | 0 | 56 | QFN | 7 x 7 mm | 0 | 56/VQFN | ||||
| IS2025 | In Production | 5.0 | -20C to 70C | 3.0V - 4.25V | Yes | Yes | No | Stereo | Yes | No | 2 | Yes | Yes | 1 | No | No | 0 | ROM | 10 | 68 | QFN | 8 x 8 mm | 0 | 68/VQFN | ||||
| IS2062 | In Production | 5.0 | -20 C to +70 C | 3.2 VV - 4.2 VV | Yes | Yes | Yes | Stereo | Yes | No | 2 | Yes | No | 0 | No | Flash | 10 | 56 | LGA | 7 x 7 mm | 0 | 56/VFLGA | ||||||
| IS2064 | In Production | 5.0 | -20 C to +70 C | 3.2 VV - 4.2 VV | Yes | Yes | Yes | Stereo | Yes | Yes | 1 | Yes | No | 0 | No | Flash | 15 | 0 | 68-pin LGA, 68-pin QFN, 61-pin BGA | 8x8 LGA, 8x8 QFN, 5x5 BGA | 0 | 61/VFBGA, 68/VFLGA, 68/VQFN | ||||||
| IS2066 | In Production | 5.0 | -20 C to +70 C | 3.2 VV - 4.2 VV | Yes | Yes | Yes | Stereo | Yes | Yes | 1 | Yes | No | 0 | No | Flash | 15 | 0 | 3.5x5 BGA | No | Yes | Yes | No | No | 50/VFBGA | |||
| IS2083 | In Production | 5.0 | -40C to +85C | 3.2VV - 4.2VV | Yes | Yes | Yes | Stereo | Yes | Yes | 2 | Yes | 1 | No | 1 | 2 | Flash | 19 | 0 | BGA | 5.5 x 5.5 mm | Yes | Yes | No | No | No | 82/VFBGA |
| Product | Status | Command Interface | Bluetooth Core Spec | Antenna Range | Module Size | LE Secure Connections | SPP | Deep Sleep Current | Bluetooth Version | Bluetooth Classic-Data/SPP | Bluetooth Classic-Audio | Bluetooth Low Energy | FCC Certified | No-shield Option | ASCII Interface | Audio Channels | Analog Audio Out | Digital Audio Out | MIC-in | Line-in | Integrated Class-D AMP | I2C | SPI | PWM | ADC Channels | Memory Type | GPIO | Pin Count | Package Type | Package Size | Temp Range Min | Temp Range Max | Operation Voltage Min | Operation Voltage Max | Packages |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ATBTLC1000-MR | Mature Product | 5.0 | No | No | Yes | Yes | No | No | No | 0 | 2 | Yes | 15 | 24 | Surface mount module | 12.7 x 20.2 mm | -40C | +85C | 1.8V | 4.3V | 24/MODULE | ||||||||||||||
| BM20 | In Production | 5.0 | Yes | Yes | No | Yes | Yes | No | Stereo | Yes | No | 2 | Yes | No | 0 | No | No | No | ROM | 12 | 40 | Surface mount module | 29 x 15 x 2.5 mm | -20C | 70C | 3.0V | 4.2V | 40/MODULE | |||||||
| BM23 | In Production | 5.0 | Yes | Yes | No | Yes | Yes | No | Stereo | No | Yes | 1 | Yes | No | 0 | No | No | No | ROM | 12 | 43 | Surface mount module | 29 x 15 x 2.5 mm | -20C | 70C | 3.0V | 4.2V | 43/MODULE | |||||||
| BM62 | In Production | 5.0 | Yes | Yes | Yes | Yes | Yes | No | Stereo | Yes | No | 1 | Yes | No | 0 | No | Flash | 10 | 37 | Surface mount module | 29 x 15 x 2.5mm | -20 C | +70 C | 3.2 V | 4.2 V | 40/MODULE | |||||||||
| BM64 | In Production Consider: BM83 | 32 x 15 x 2.5 mm | 0 | Yes | 5.0 | Yes | Yes | Yes | Yes | Yes | No | Stereo | Yes | Yes | 1 | Yes | No | 0 | No | Flash | 12 | 43 | Surface mount module | -20 C | +70 C | 3.2 V | 4.2 V | 43/Module | |||||||
| BM70 | In Production | Binary | 5.0 | Up to 50 meters | 22 x 12 x 2.4 mm | 0 | 5.0 | No | No | Yes | Yes | Yes | No | No | No | No | 0 | No | No | 0 | No | 3 | 8 | Flash | 18 | 33 | Surface mount module | 22 x 12 x 2.4 mm | -40C | +85C | 1.9V | 3.6V | 33/MODULE, 30/MODULE | ||
| BM71 | In Production | Binary | 5.0 | Up to 10 meters | 9 x 11.5 x 2.1 mm | 0 | 5.0 | No | No | Yes | Yes | Yes | No | No | No | No | 0 | No | No | 0 | No | Yes | 5 | Flash | 9 | 16 | Surface mount module | 9 x 11.5 x 2.1mm | -40C | +85C | 1.9V | 3.6V | 17/MODULE, 16/MODULE | ||
| BM77 | Mature Product Consider: BM78 | 4.0 | Yes | No | Yes | Yes | Yes | No | No | No | No | 0 | No | No | 1 | No | No | No | Flash | 7 | 33 | Surface mount module | 22 x 12 x 2.4 mm, 15 x 12 x 1.8mm | -20C | +70C | 3.2V | 4.3V | 30/MODULE, 33/MODULE | |||||||
| BM78 | In Production | 5.0 | Yes | No | Yes | Yes | Yes | No | No | No | No | 0 | No | No | 1 | No | No | No | Flash/ROM | 7 | 33 | Surface mount module | 22 x 12 x 2.4 mm, 15 x 12 x 1.8mm | -20C | +70C | 3.3V | 4.2V | 30/MODULE, 33/MODULE | |||||||
| BM90 | Mature Product Consider: BM83 | 3.0 | No | Yes | No | No | No | No | Stereo | Yes | No | 1 | Yes | No | 0 | No | No | No | ROM | 10 | 40 | Surface mount module | 29 x 15 x 1.8 mm | -20C | 70C | 3.0V | 4.25V | Please call for package information | |||||||
| RN4020 | In Production | 4.1 | No | No | Yes | Yes | No | Yes | No | No | No | 0 | No | No | 0 | No | No | No | Flash | 10 | 24 | Surface mount module | 11.5 x 19.5 x 2.5 mm | -30C | 85C | 1.8V | 3.6V | 22/Module | |||||||
| RN41 | Mature Product | 2.1 + EDR | Yes | No | No | Yes | No | Yes | No | No | No | 0 | No | No | 0 | No | No | No | Flash | 11 | 35 | Surface mount module | 13.4 x 25.8 x 2 mm | -40C | 85C | 3.0V | 3.6V | 35/Module | |||||||
| RN41XV | Mature Product | 2.1 + EDR | Yes | No | No | Yes | No | Yes | No | No | No | 0 | No | No | 0 | No | No | No | Flash | 11 | 10 | Socket module | 24.4 x 29.0 mm | -40C | 85C | 3.0V | 3.6V | 20/Module | |||||||
| RN42 | Mature Product Consider: RN4678 | 2.1 + EDR | Yes | No | No | Yes | No | Yes | No | No | No | 0 | No | No | 0 | No | No | No | Flash | 11 | 35 | Surface mount module | 13.4 x 25.8 x 2.4 mm | -40C | 85C | 3.0V | 3.6V | 35/Module | |||||||
| RN42XV | Mature Product Consider: RN4678 | 2.1 + EDR | Yes | No | No | Yes | No | Yes | No | No | No | 0 | No | No | 0 | No | No | No | Flash | 11 | 10 | Socket module | 24.4 x 29.9 mm | -40C | 85C | 3.0V | 3.6V | 20/Module | |||||||
| RN4677 | Mature Product Consider: RN4678 | 4.0 | Yes | No | Yes | Yes | No | Yes | No | No | No | 0 | No | No | 0 | No | No | No | Flash | 7 | 33 | Surface mount module | 22 x 12 x 2.4 mm | -20C | 70C | 3.2V | 4.3V | 33/MODULE | |||||||
| RN4678 | In Production | ASCII | 5.0 | Up to 50 meters | 22 x 12 x 2.4 mm | 0 | 5.0 | Yes | No | Yes | Yes | Yes | Yes | No | No | No | 0 | No | No | 0 | Yes | Flash | 8 | 33 | Surface mount module | 22 x 12 x 2.4 mm | -20 | 70 | 3.2 | 4.3 | 33/MODULE | ||||
| RN4870 | In Production | ASCII | 5.0 | Up to 50 meters | Shield 12 x 22 mm, Unshielded 12 x 15 mm | 1 | 5.0 | No | No | Yes | Yes | Yes | Yes | No | No | No | 0 | No | No | 0 | No | 3 | Flash | 12 | 33 | Surface mount module | Shield 12 x 22 mm, Unshield 12x15mm | -40C | +85C | 1.9V | 3.6V | 33/MODULE, 30/MODULE | |||
| RN4871 | In Production | ASCII | 5.0 | Up to 10 meters | Shield 9 x 11.5 mm, Unshielded 6 x 8 mm | 0 | 5.0 | No | No | Yes | Yes | Yes | Yes | No | No | No | 0 | No | No | 0 | No | 1 | Flash | 4 | 16 | Surface mount module | Shield 9 x 11.5 mm, Unshield 6x8mm | -40C | +85C | 1.9V | 3.6V | 16/MODULE, 17/MODULE | |||
| RN52 | Mature Product Consider: BM83 | 3.0 | Yes | Yes | No | Yes | No | Yes | Stereo | Yes | Yes | 2 | Yes | No | 1 | Yes | No | 2 | Flash | 11 | 50 | Surface mount module | 13.5 x 26.0 x 2.7 mm | -40C | 85C | 3.0V | 3.6V | 35/Module |
- Application Notes
- Brochures
- CAD Resources
- Certifications
- Data Sheet
- Product Line
- Software
- User Guides
- Other
| Title | Download |
|---|---|
| PIC MCU - eXtreme Low Power Solutions for Wearable Applications | Download |
| Title | Download |
|---|---|
| Bluetooth CCAT | Download |
| Qualification Guideline Handout | Download |
| RN41 FCC Grant of Equipment Authorization | Download |
| RN41 Certification (Canada - IC) | Download |
| RN4020 Bluetooth SIG QDID Listing | Download |
| RN41 Bluetooth SIG QDID Listing | Download |
| RN52 Canada Certification | Download |
| RN52 Japan Certification | Download |
| RN41N Certification and Test Report (Canada - IC) | Download |
| RN52 Europe Certification Reports | Download |
| RN4020 FCC Grant of Equipment Authorization | Download |
| RN42 FCC Grant of Equipment Authorization | Download |
| RN42 Korea KCC Certification | Download |
| RN52 FCC Grant of Equipment Authorization | Download |
| RN42 Europe Certification Reports | Download |
| RN41N Europe Certification Reports | Download |
| RN41N Taiwan Certification | Download |
| RN42 Bluetooth SIG QDID Listing | Download |
| RN41N FCC Grant of Equipment Authorization | Download |
| RN41 Certification and Test Report (Japan) | Download |
| RN41 Europe Certification Reports | Download |
| RN4020 IC Certification | Download |
| RN52 Korea Certification | Download |
| Title | Download |
|---|---|
| Data sheet RN-240 | Download |
| Title | Download |
|---|---|
| Bluetooth Firmware Ver. 6.15 Release Notes | Download |
| Title | Download |
|---|---|
| RN240- Teraterm | Download |
| Title | Download |
|---|---|
| RN4020- Sell Sheet | Download |
Introducing Microchip's WFI32 Wi-Fi 32-bit MCU Module
This video introduces Microchip’s first Trust&GO Wi-Fi® 32-bit MCU, which has market leading MCU functionalities and is pre-provisioned for cloud platforms.
Introducing Microchip's WFI32 Wi-Fi 32-bit MCU Module
Introducing Microchip's WFI32 Wi-Fi 32-bit MCU Module
This video introduces Microchip’s first Trust&GO Wi-Fi® 32-bit MCU, which has market leading MCU functionalities and is pre-provisioned for cloud platforms.
Wi-Fi® Smart Device Enablement Kit
Wi-Fi® Smart Device Enablement Kit
[MNV378B] Microchip’s new Wi-Fi Smart Device Enablement Kit makes it even easier to allow customers to control their apps with Alexa voice commands.
AVR-IoT WG Development Board Introduction
AVR-IoT WG Development Board Introduction
This video provides an overview of the AVR-IoT WG Development board. The AVR-IoT WG board was designed to be extremely easy to use, secure and low power. With this device, you will be able to connect your IoT node to the internet in 30 seconds or less.
PIC-IoT WG Development Board
PIC-IoT WG Development Board
This video provides an overview of the PIC-IoT WG Development board. The PIC-IoT WG board was designed to be extremely easy to use, secure and low power. With this device, you will be able to connect your IoT node to the internet in 30 seconds or less.
Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology
Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology
[MNV 348] Create high-resolution audio devices using Microchip’s new bluetooth® audio SoC with Sony’s LDAC™ technology
Smallest Sub-GHz Module For Low-Power Wireless Sensing
Smallest Sub-GHz Module For Low-Power Wireless Sensing
[MNV366] Develop low-power wireless sensor nodes with the industry’s smallest regulatory-certified sub-Ghz module
The Industry’s Lowest-Power LoRa® System-in-Package
The Industry’s Lowest-Power LoRa® System-in-Package
[MNV355] Accelerate development of remote IoT nodes with the industry’s lowest-power LoRa® system-in-package family
Easy Connectivity with Dual-Mode Bluetooth® Module
Easy Connectivity with Dual-Mode Bluetooth® Module
[MNV300] New dual-mode Bluetooth® module features enhanced security and easy-to-use interface.
Microchip’s RN4870 & RN4871 Modules for Bluetooth® Low Energy 5.0 Core Spec. w/ ASCII-style Commands
Microchip’s RN4870 & RN4871 Modules for Bluetooth® Low Energy 5.0 Core Spec. w/ ASCII-style Commands
[MNV287] Microchip announces next-generation Bluetooth® Low Energy solutions with easy-to-use interface and embedded scripting capability.
Dual-Mode Bluetooth® SoCs and Modules for High-End Audio
Dual-Mode Bluetooth® SoCs and Modules for High-End Audio
[MNV288] Next generation dual-mode Bluetooth® audio products from Microchip.
Microchip’s First LoRa™ Module is IoT-Ready
Microchip’s First LoRa™ Module is IoT-Ready
[MNV238] Microchip's LoRa™ technology wireless module enables IoT and is the first module for ultra-long range and low-power network standard.
Advanced Bluetooth Audio SoC for Wireless Earbuds
Advanced Bluetooth Audio SoC for Wireless Earbuds
The IS2066B is a low power Bluetooth Audio System-on-Chip (SoC) with Microchip’s Wireless Stereo Technology (WST) for Bluetooth Audio applications targeting wireless earbuds.
WFI32 Wi-Fi® MCU Module Development Tools Introduction
WFI32 Wi-Fi® MCU Module Development Tools Introduction
Along with the widely adaption of IoT technology in industrial areas, like logistics, heath care, utility, and high-end manufacturing, IoT designers are paying more attention at improving the reliability, security, and functionality of the IoT system design, because reliable and robust IoT data is critical to improve the efficiency of operations, quality of services, and business income.
Microchip’s highly integrated WFI32 Wi-Fi MCU module is safe, powerful, and reliable IoT platform, which can be used to design various industrial IoT systems with high-performance MCU capabilities and robust and safe IoT connection.
