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KSZ8721

10/100 Base-T/TX/FX Ethernet Transceiver

Status: Not Recommended for new designs

Features:

  • Single chip 100BaseTX/100BaseFX/10BaseT physical layer solution
  • 2.5V CMOS design, power consumption <200mW (excluding output driver current)
  • Fully compliant to IEEE 802.3u standard
  • Supports Media Independent Interface (MII) and Reduced MII (RMII)
  • Supports 10BaseT, 100BaseTX and 100BaseFX with Far_End_Fault Detection
  • Supports power down mode and power saving mode
  • Configurable through MII serial management ports or via external control pins
  • Supports auto-negotiation and manual selection for 10/100Mbps speed and full/half-duplex mode
  • On-chip built-in analog front end filtering for both 100BaseTX and 10BaseT
  • LED outputs for link, activity, full/half duplex, collision, and speed
  • Supports back to back, FX to TX for media converter applications
  • Supports MDI/MDI-X auto crossover
  • 2.5V/3.3V tolerance on I/O
  • Commercial temperature range: 0°C to +70°C
  • Industrial temperature range: –40°C to +85°C
  • Available in 48-pin LQFP, SSOP and TQFP packages
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

Operating at 2.5 volts to meet low voltage and low power requirements, the KSZ8721 is a 10BaseT/100BaseTX/FX Physical Layer Transceiver, which provides an MII to transmit and receive data.

It contains the 10BaseT Physical Medium Attachment (PMA), Physical Medium Dependent (PMD), and Physical Coding Sub-layer (PCS) functions. Moreover, the KSZ8721 has on-chip 10BaseT output filtering, which eliminates the need for external filters and allows a single set of line magnetics to be used to meet requirements for both 100BaseTX and 10BaseT.

The KSZ8721 can automatically configure itself for 100 or 10 Mbps and full or half duplex operation, using on-chip Auto-Negotiation algorithm. It is an ideal choice of physical layer transceiver for 100BaseTX/10BaseT applications.

Microchip's complimentary and confidential LANCheck® online design review service is available for customers who have selected our products for their application design-in. The LANCheck online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.

Please consider this device KSZ8081, KSZ8091

Additional Features
    • Single chip 100BaseTX/100BaseFX/10BaseT physical layer solution
    • 2.5V CMOS design, power consumption <200mW (excluding output driver current)
    • Fully compliant to IEEE 802.3u standard
    • Supports Media Independent Interface (MII) and Reduced MII (RMII)
    • Supports 10BaseT, 100BaseTX and 100BaseFX with Far_End_Fault Detection
    • Supports power down mode and power saving mode
    • Configurable through MII serial management ports or via external control pins
    • Supports auto-negotiation and manual selection for 10/100Mbps speed and full/half-duplex mode
    • On-chip built-in analog front end filtering for both 100BaseTX and 10BaseT
    • LED outputs for link, activity, full/half duplex, collision, and speed
    • Supports back to back, FX to TX for media converter applications
    • Supports MDI/MDI-X auto crossover
    • 2.5V/3.3V tolerance on I/O
    • Commercial temperature range: 0°C to +70°C
    • Industrial temperature range: –40°C to +85°C
    • Available in 48-pin LQFP, SSOP and TQFP packages
Parametrics
Name
Value
Description
10/100 Base-TX/FX PHY, Legacy (EtherCAT Ref Design)
Ethernet Bandwidth
10/100Mbps / FX
LEDs
4
# of Ethernet Ports
1
Interface
MII/RMII
Temp. Range Min. (°C)
-40
Temp. Range Max. (°C)
85
HP-Auto MDIX
Yes
Interface1
MII, RMII
Copper Support
Yes
Fiber Support
100FX
Supply Voltage (V)
3.3
MAC I/O Voltage
2.5/3.3
Cable Diagnostics
Yes
Supports EtherCAT
X

Documents

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Supporting Collateral

Development Environment

  • Software Libraries
Software Libraries
Driver is located in Linux Kernel

The driver for this device resides in the Linux Kernel found here https://www.kernel.org/

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
KSZ8721B
1.366667
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721BI
1.366667
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721BI-TR
1.438000
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721B-TR
1.438000
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721SL-TR
1.438000
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721SLI-TR
1.438000
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721SL
1.366667
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721SLI
1.366667
48
SSOP
15.8x7.6mm
Matte Tin
e3
KSZ8721CL
0.155500
0.694000
48
LQFP
7x7x1.4mm
Matte Tin
e3
KSZ8721CL-TR
0.155500
0.768000
48
LQFP
7x7x1.4mm
Matte Tin
e3
KSZ8721BLI
0.155500
0.694000
48
LQFP
7x7x1.4mm
Matte Tin
e3
KSZ8721BL
0.155500
0.694000
48
LQFP
7x7x1.4mm
Matte Tin
e3
KSZ8721BL-TR
0.155500
0.768000
48
LQFP
7x7x1.4mm
Matte Tin
e3
KSZ8721BLI-TR
0.155500
0.768000
48
LQFP
7x7x1.4mm
Matte Tin
e3
KSZ8721BT
0.125200
0.852000
48
TQFP
7x7x1.0mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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