Microchip Technology Inc
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SST26VF016B

16Mb 2.3-3.6V Serial Quad I/O (SQI) Flash

Status: In Production

Features:

  • Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure
  • Mode 0 and Mode 3,
  • x1/x2/x4 Serial Peripheral Interface (SPI) Protocol and SQI protocol
  • Burst Modes- Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
  • Page-Program- 256 Bytes per page in x1 or x4 mode
  • Flexible Erase Capability- Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
  • Software Write Protection- Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
  • Low Power Consumption: Active Read current: 15 mA (typical @ 104 MHz), Standby Current: 15 µA (typical), Deep Power-Down Current: 2.5uA (typical)
  • SFDP (Serial Flash Discoverable Parameters)
  • Packages Available: 8-contact WDFN (6mm x 5mm), 8-lead SOIC, 8-lead SOIJ
  • All devices are RoHS compliant
  • Industrial -40C to +85C; Extended -40C to +105C
  • Automotive Grade 2 and 3 available
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST26VF016B Serial Quad I/O (SQI) flash device utilizes a 4-bit multiplexed I/O serial interface to boost performance while maintaining the compact form factor of standard serial flash devices. SST26VF016B also support full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol. Operating at frequencies reaching 104 MHz, the SST26VF016B enables minimum latency execute-in-place (XIP) capability without the need for code shadowing on an SRAM. The device’s high performance and reliability make it the ideal choice for Network Appliance, DSL and Cable Modems, Wireless Lan, Computing, Digital TV, Smart Meter, Server, Set Top Box, Automotive and other Industrial applications. Further benefits are achieved with SST’s proprietary, high-performance CMOS SuperFlash® technology, which significantly improves performance and reliability, and lowers power consumption for high bandwidth, compact designs.

Additional Features
    • Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure
    • Mode 0 and Mode 3,
    • x1/x2/x4 Serial Peripheral Interface (SPI) Protocol and SQI protocol
    • Burst Modes- Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
    • Page-Program- 256 Bytes per page in x1 or x4 mode
    • Flexible Erase Capability- Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
    • Software Write Protection- Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
    • Low Power Consumption: Active Read current: 15 mA (typical @ 104 MHz), Standby Current: 15 µA (typical), Deep Power-Down Current: 2.5uA (typical)
    • SFDP (Serial Flash Discoverable Parameters)
    • Packages Available: 8-contact WDFN (6mm x 5mm), 8-lead SOIC, 8-lead SOIJ
    • All devices are RoHS compliant
    • Temperature Range:
      • Industrial -40C to +85C; Extended -40C to +105C
    • Automotive Grade 2 and 3 available
    Parametrics
    Name
    Value
    Density
    16 Mbit
    Op. Volt Range (V)
    2.3 to 3.6
    Max. Clock Freq.
    104 MHz
    Page Size (bytes)
    256
    Temp Range (°C)
    See Data Sheet for Specific Temperature Range
    Endurance
    100,000
    Data Retention (Years)
    100
    Bus Modes
    SPI,SDI,SQI

    Documents

    Jump to:

    Brochures

    12/19/2017
    3698KB

    IBIS

    Software

    02/28/2018
    408KB

    Development Environment

    • Programmers
    Programmers
    MPLAB PM3 Universal Device Programmer
    MPLAB PM3 Universal Device Programmer ( DV007004 )

    The MPLAB® PM3 Universal Device Programmer is easy to use and operates with a PC or as a stand-alone unit, and programs Microchip's entire line of PIC® devices as well as the latest dsPIC® DSC devices. When used standalone, data can be loaded and saved with the SD/MMC card (not included).

    • Socket: AC164302   PartNo: SST26VF016B (8SN)
    • Socket: AC164312   PartNo: SST26VF016B (8SM)
    Learn More
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    RoHS Information

    Part Number
    Device Weight (g)
    Shipping Weight (Kg)
    Lead Count
    Package Type
    Package Width
    Solder Composition
    JEDEC Indicator
    RoHS
    China EFUP
    SST26VF016B-104V/SM70SVAO
    0.124400
    0.266667
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016BT-104V/SM70SVAO
    0.124400
    0.379048
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016BT-104I/SM70SVAO
    0.124400
    0.379048
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016B-104I/SM
    0.124400
    0.266667
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016BT-104I/SM
    0.124400
    0.379048
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016B-104V/SM
    0.124400
    0.266667
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016BT-104V/SM
    0.124400
    0.379048
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016B-104I/SM70SVAO
    0.124400
    0.266667
    8
    SOIJ
    .208in
    Matte Tin
    e3
    SST26VF016B-104V/SN
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016BT-104V/SN
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016B-104I/SN
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016BT-104I/SN
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016B-104I/SN70SVAO
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016B-104V/SN70SVAO
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016BT-104V/SN70SVAO
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016BT-104I/SN70SVAO
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    SST26VF016B-104I/MFA24
    0.073800
    0.359649
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016B-104V/MF
    0.073800
    0.163265
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016BT-104V/MF
    0.073800
    0.200000
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016B-104I/MF
    0.073800
    0.163265
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016BT-104I/MF
    0.073800
    0.200000
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016B-104I/MF70SVAO
    0.073800
    0.163265
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016B-104V/MF70SVAO
    0.073800
    0.163265
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016BT-104V/MF70SVAO
    0.073800
    0.200000
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    SST26VF016BT-104I/MF70SVAO
    0.073800
    0.200000
    8
    TDFN-S
    6x5x0.8mm
    Matte Tin
    e3
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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