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MGC3140

Status: In Production

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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

MGC3140 is the world’s first Automotive qualified electrical-field (E-field) based three-dimensional (3D) tracking and gesture controller. The chip is based on Microchip’s patented GestIC® technology and enables user command input with natural hand and finger movements in free-space. The GestIC Colibri Suite is processed on-chip and enables a wide range of gesture applications shortening time-to-market success.

The MGC3140 represents a unique and high performance single chip gesture solution focusing on Automotive applications. MGC3140 provides gesture and proximity detection enabling modern and compelling user interfaces to be created and is suitable for Consumer, Industrial and Automotive applications.

A Linux driver is available on the Microchip Github server:

https://github.com/MicrochipTech/linux-at91-Gestic/

 

 

Additional Features
  • AEC-Q100 Qualified
  • 5 Tx Electrode
  • 5 Rx Electrodes
  • Communication via serial I2C interface
  • Sensing Type: E-Field
  • Detection Range: 0 to 20 cm
  • Resolution: 200 dpi
  • 5 pin Gesture Port
  • Package Type: 48-pin 6x6mm UQFN
  • Operating Temperature Range: -40 degC to +125 degC
Parametrics
Name
Value
Product Type
3D Positioning/Gesture
Input Channels
5
Proximity detection
Yes
Output Channels
5
Measurement Principle
E-Field
Report Rate (pps)
200
Power
3.3Vdc ±5%
Power Modes
3
Interface
I2C
I/O, LED Drivers
5
Voltage Range
3.14V - 3.47V

Documents

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Software Libraries/Firmware

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
MGC3140 Emerald Evaluation Kit
MGC3140 Emerald Evaluation Kit ( DM160238 )

The MGC3140 Emerald Development Kit builds a complete MGC3140 reference system for evaluation as well as the design-in of 3D gesture input sensing systems.

The MGC3140 Emerald Development Kit is based on Microchip's award winning GestIC technology and enables true single chip 3D gesture detection.

The design-in is simplified with the help of the AUREA GUI.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MGC3140-E/MV
0.063800
0.114754
48
UQFN
6x6x0.5mm
Matte Tin
e3
MGC3140-I/MV
0.063800
0.114754
48
UQFN
6x6x0.5mm
Matte Tin
e3
MGC3140T-E/MV
0.063800
0.153333
48
UQFN
6x6x0.5mm
Matte Tin
e3
MGC3140T-I/MV
0.063800
0.153333
48
UQFN
6x6x0.5mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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