Addressing AI Server Power Density Requirements With Microchip’s MCPF1525 Power Module

As artificial intelligence (AI) workloads continue to grow in scale and complexity, data centers are under pressure to deliver more computing power within increasingly limited physical spaces. The key challenge is power density—providing high levels of electrical power to densely packed server boards without compromising efficiency, reliability or thermal management.

Meeting the Power Density Challenge

AI servers are designed to host multiple high-performance processors, GPUs and memory modules, all of which demand substantial power. Traditional power delivery solutions often struggle to keep up with these requirements, especially as server designs become more compact. The Microchip MCPF1525 power module directly addresses this challenge by offering:

• High Current Delivery in a Small Footprint:
  Each MCPF1525 module delivers 25A of DC-DC power and can be stacked to provide up to 200A. This enables data center operators to supply the necessary power for advanced AI workloads without expanding rack space, supporting higher compute density per server.
• Space-Efficient Vertical Construction:
  The module’s innovative vertical design reduces board area by over 40% compared to discrete solutions. Its compact dimensions (6.8 mm × 7.65 mm × 3.82 mm) allow for more modules to be installed in the same space, maximizing the number of processors and memory units that can be powered within a single server chassis.
• Optimized for Advanced AI Hardware:
  The MCPF1525 is engineered to support the latest PCIe^® switches and high-performance compute MPUs, which are central to AI server architectures. By efficiently powering these components, the module enables data centers to deploy cutting-edge AI solutions without being constrained by power delivery limitations.

Enhancing Reliability and Efficiency in High-Density Environments

High power density can increase the risk of overheating and electrical faults. The MCPF1525 mitigates these risks with:

• Thermally Enhanced Packaging:
  Designed to operate from -40°C to +125°C, the module maintains reliable performance even in tightly packed, high-temperature environments.
• Advanced Diagnostics and Protection:
  Integrated PMBus™ monitoring provides real-time diagnostics for over-temperature, over-current and over-voltage conditions, helping prevent failures that could disrupt AI workloads.
• Programmable Power Management:
  Embedded EPROM and programmable controls allow for tailored power-up configurations and dynamic adjustment, providing optimal power delivery for varying AI server demands.

Conclusion

Our MCPF1525 power module is purpose-built to meet the power density requirements of modern AI servers. Its high current capability, compact design and robust protection features enable data centers to maximize compute resources and efficiency, paving the way for the next generation of AI-driven applications.

For more information, visit our MCPF1525 product page.