Product Roundup: February 2026

MPU System in Package (SiP) Solutions

Microchip's portfolio of MPU System-in-Packages (SiPs) includes the SAM9X, SAMA5 and SAMA7 families, with DRAM memory densities ranging from 64 Mb to 4 Gb directly within the package. The semiconductor industry faces a structural DRAM shortage driven by consolidation among memory manufacturers, capacity constraints and surging AI demand that's redirecting supply toward high-margin data center applications. For customers evaluating traditional approaches such as combining MPUs, discretes and DRAM or developers requiring higher processing capability available in traditional MCUs, Microchip’s  SiPs offer a fully integrated solution that delivers both immediate availability and long-term supply security.  This architecture eliminates designers' exposure to volatile DRAM spot markets and unpredictable lead times as Microchip can service orders with standard lead times, providing the supply certainty that production schedules demand. The SiP approach also solves the complex PCB routing challenges associated with high-speed DDR interfaces, reducing design risk and accelerating time-to-market. Microchip’s SiPs are an optimal solution for industrial, automotive and IoT applications where system reliability and consistent availability are critical.

Radiation-Tolerant PolarFire® Mil-Plastic FPGAs

Designed for New Space missions and satellite developers facing tight budgets and aggressive schedules, Microchip’s RT PolarFire® Mil‑Plastic FPGA delivers radiation‑tolerant performance in a cost‑effective plastic package. Built on the same proven silicon as the Qualified Manufacturing List (QML)–qualified RT PolarFire RTPF500ZT devices, it inherits the same silicon reliability and radiation performance and is qualified to Joint Electron Device Engineering Council (JEDEC) standards.

Unlike SRAM‑based alternatives, RT PolarFire Mil‑Plastic FPGAs offer class‑leading low power consumption and zero configuration upsets in radiation, combined with RT military‑temperature screening. With readily available qualification and Total Ionizing Dose (TID) radiation data, developers can confidently reduce risk while accelerating time to market. By pairing QML‑class silicon reliability and radiation tolerance with a lower‑cost plastic package, RT PolarFire Mil‑Plastic FPGAs provide a reliable, economical solution for space applications—helping customers meet mission requirements faster and more cost‑effectively.

High-Voltage Bidirectional Auxiliary E-Fuse Reference Design

The new High‑Voltage Bidirectional Auxiliary E‑Fuse Reference Design extends Microchip’s proven Auxiliary E‑Fuse platform to support bidirectional current blocking and interruption for high‑voltage DC systems. This reference design targets 400V and 800V architectures and demonstrates up to 15A continuous solid‑state protection using Microchip mSiC® MOSFETs, configurable time‑current characteristics (TCC), and LIN‑based configuration and diagnostics. It is intended to help customers replace traditional fuses, relays, and contactors in auxiliary high‑voltage power paths with a faster, resettable and more controllable solution.

High‑Voltage Hardware‑Based E‑Fuse Reference Design

The High‑Voltage Hardware‑Based E‑Fuse Reference Design is a full hardware‑only, microcontroller‑free solution optimized for high‑voltage bidirectional AC and DC applications. This reference design supports 400V and 800V system configurations and demonstrates bidirectional current blocking using mSiC® Silicon Carbide MOSFETs, with fast overload and short‑circuit protection implemented entirely in hardware. The modular architecture separates control and power boards, enabling scalable integration across multiple high‑voltage use cases.

Resources

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