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SST25VF512

512Kb 2.7-3.6V SPI Serial Flash

Status: In Production

Features:

  • Serial Interface Architecture – SPI Compatible: Mode 0 and Mode 3
  • Low Power Consumption: – Active Read Current: 7 mA (typical) – Standby Current: 8 µA (typical)
  • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 32 KByte overlay blocks
  • Fast Erase and Byte-Program: – Chip-Erase Time: 70 ms (typical) – Sector- or Block-Erase Time: 18 ms (typical) – Byte-Program Time: 14 µs (typical)
  • Auto Address Increment (AAI) Programming – Decrease total chip programming time over Byte-Program operations
  • Packages Available – 8-lead SOIC (4.9mm x 6mm) – 8-contact WSON
  • All non-Pb (lead-free) devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

SST25VF512 SPI serial flash memory is manufactured with SST's proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.

Additional Features
  • Serial Interface Architecture– SPI Compatible: Mode 0 and Mode 3
  • Low Power Consumption:– Active Read Current: 7 mA (typical)– Standby Current: 8 µA (typical)
  • Flexible Erase Capability– Uniform 4 KByte sectors– Uniform 32 KByte overlay blocks
  • Fast Erase and Byte-Program:– Chip-Erase Time: 70 ms (typical)– Sector- or Block-Erase Time: 18 ms (typical)– Byte-Program Time: 14 µs (typical)
  • Auto Address Increment (AAI) Programming– Decrease total chip programming time overByte-Program operations
  • Packages Available– 8-lead SOIC (4.9mm x 6mm)– 8-contact WSON
  • All non-Pb (lead-free) devices are RoHS compliant
Parametrics
Name
Value
Density
512 Kbit
Op. Volt Range (V)
2.7 to 3.6
Max. Clock Freq.
20 MHz
Temp Range (°C)
0°C to +70°C
Endurance
100,000
Bus Modes
SPI

Documents

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Development Environment

  • Code Examples

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST25VF512-20-4C-SAE
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25VF512-20-4C-SAE-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25VF512A-33-4C-SAE
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25VF512A-33-4C-SAE-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25VF512A-33-4I-SAE
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25VF512A-33-4I-SAE-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST25VF512A-33-4C-QAE
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25VF512A-33-4C-QAE-T
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25VF512A-33-4I-QAE
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST25VF512A-33-4I-QAE-T
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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