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IS1870

Bluetooth Low Energy System on a Chip

Status: In Production

Features:

  • Available in certified modules BM70
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

Microchip's IS1870 BLE ICs are designed for App-enabled accessories and IoT (Internet of Things) through Bluetooth® LE connectivity.  It is available in the 2.4GHz ISM band radio, and is certified to Bluetooth Core Specification Version 5.0. For improving user experiences for IoT applications, BeaconThings Technology is applied to allow users to automatically control and receive data to the cloud without opening an iPhone App. 

The IS1870 allows customers to finish their design faster and more efficiently.  It combines both the transceiver and baseband functions to decrease the external components.  In addition, the free Bluetooth stack firmware is provided enabling products to quickly become embedded Bluetooth LE solution.  For portable and wearable applications, the product's optimized power design minimizes current consumption for extended battery life and minimal package size.

The BM-70-PICtail or BM70 modules are recommended for evaluation.  Please contact your authorized Microchip representative if IC samples are required.

Additional Features
  • Bluetooth 5 Certified
  • 1.9V~3.6V (VDD) operating range
  • Low-power consumption
  • Average current: TX 3.87mA/RX 3.06mA with Buck,@ VBAT=3.0V and 18.75ms Connection Interval
  • UART interface
  • Main X’tal : 32MHz
  • 256K Bytes embedded flash memory
  • Temperature sensor supported
  • Flexible GPIO pin configuration
  • 3 channels PWM supported
  • 16-ch 12 bits ADC supported for battery and voltage detection
  • Provides proprietary BeaconThings® service
  • ISM Band 2.402 to 2.480 GHz operation
  • Channels 0-39
  • Rx sensitivity: -90dBm@ BLE, typical
  • Programmable Tx Power: -25 to +3 dBm
  • RSSI monitor
  • Available in certified modules BM70
Parametrics
Name
Value
Bluetooth Low Energy
Yes
PWM
3
ADC Channels
16
TX Power
0 dBm
GPIO
31
Pin Count
48
Package Type
QFN
Package Size
6 x 6 mm
Temperature Range
-40 to +85C
Operating Voltage Range
1.9 to 3.6

Documents

Jump to:

Data Sheets

  
2373KB

Board Design Files

User Guides

  
10835KB

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
BM70 PICtail Plus
BM70 PICtail Plus ( BM-70-PICtail )

The BM-70-PICtail/PICtail Plus Board is designed to emulate the function of Microchip's BM70 BLE module.  It also enables the customer to evaluate and demonstrate the capabilities of the BM70 BLE module.   The board includes an integrated configuration and programming interface for plug-and-play capability.  It also provides an integrated test environment for all functions supported...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
IS1870SF-102
0.102200
0.196000
48
VQFN
6x6x0.9mm
Matte Tin
e3
IS1870SF-202
0.102200
0.196000
48
VQFN
6x6x0.9mm
Matte Tin
e3
IS1870SF-202-TRAY
0.102200
0.436735
48
VQFN
6x6x0.9mm
Matte Tin
e3
IS1870SF-102-TRAY
0.102200
0.436735
48
VQFN
6x6x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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