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AAP661

Electret Condenser Microphone (ECM) Analog Pre-amplifier

Status: In Production

Features:

  • Selectable gain configurations - 16dB and 19dB
  • Ultra low input capacitance - 0.35pF typical
  • Ultra low equivalent input noise performance - 1.9?VRMS to 2.5?VRMS (Cmic = SC, varies with gain)
  • 8kV ESD tolerance
  • High RFI tolerance, low output impedance (25?)
  • Excellent THD performance (<0.5%)
  • Ultra low quiescent current (250?A typical)
  • Chip-scale SMD bumped packaging (930?m x 580?m, 350?m thick)
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

"Electret Condenser Microphone (ECM) Pre-Amplifier w/Programmable HPF The AAP661X ECM Pre Amplifiers were designed for the recent exclusive use of Plantronics, Inc. of Santa Cruz, CA for high end audio headset microphone applications. The AAP661X is now available for general sale to the audio microphone marketplace. The performance of this Pre-Amplifier is such that it enables design of enhanced end system products, due to its various gain options, ultralow noise and other high performance features. The AAP661X ECM Pre-Amplifier provides a number of performance advantages over prior ECM Pre-Amplifier products. Key features include ultra low input capacitance (0.35pF typical) and quiescent current (250?A typical), with ultra low equivalent input noise (1.9 to 2.5 ?V RMS, A-Weighted, with the microphone capacitor short circuited, gain version dependent). Additionally, the Pre-Amplifier sports a programmable high pass filter with operation down to 1.6V. Other key features include THD performance below 0.5% maximum, output impedance of 25? typical, with exceptionally high tolerance to RF interference and ESD tolerance (8kV). The AAP661X is offered with two gain options, 16dB and 19dB. Packaging is bumped chip scale SMD configuration, with a size of 930?m x 580?m and an overall thickness of 350?m (including solder bumps). Optimum for 3mm microphones, the die is RoHS compliant, with lead free solder pads of 118?m diameter. Packing styles available are 2” x 2” Waffle Pack or Tape and Reel."

Additional Features
    • Selectable gain configurations - 16dB and 19dB
    • Ultra low input capacitance - 0.35pF typical
    • Ultra low equivalent input noise performance - 1.9?VRMS to 2.5?VRMS (Cmic = SC, varies with gain)
    • 8kV ESD tolerance
    • High RFI tolerance, low output impedance (25?)
    • Excellent THD performance (<0.5%)
    • Ultra low quiescent current (250?A typical)
    • Chip-scale SMD bumped packaging (930?m x 580?m, 350?m thick)
Parametrics
Name
Value
Supply Voltage
1.6V to 5.5V
Typical Supply Voltage
1.6V
Input Capacitance
0.35pF
Gain (dB)
15,19,30
Input Referred Noise
2.5
THD
<0.5%
Quiescent current(uA)
250
Output Impedance
25
ESD (HBM)
+/-8KV
Applicable Microphone
ECM

Documents

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Data Sheets

  
358KB

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
AAP661AS-M5A-GLF-TR
0.000000
0.000000
5
WLCSP
0.95x0.60x0.345mm
SAC305
e1
AAP661BS-M5A-GLF-TR
0.000000
0.000000
5
WLCSP
0.95x0.60x0.345mm
SAC305
e1
AAP661CS-M5A-GLF-TR
0.000000
0.000000
5
WLCSP
0.95x0.60x0.345mm
SAC305
e1
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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