Adding Flexibility by Using Multiple Footprints for Microwire Serial EEPROMs
For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more and more commonplace. This offers a number of benefies; the reductions in footprint size and component height are some of the obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.
EEPROM, footprint, flexibility, microwire