Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

AN1420

Title:
Adding Flexibility by Using Multiple Footprints for Microwire Serial EEPROMs
Name:
AN1420
Date:
12/14/2011
Author:
Chris Parris
Description:
For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more and more commonplace. This offers a number of benefies; the reductions in footprint size and component height are some of the obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.
Keywords:
EEPROM, footprint, flexibility, microwire
 
Application Notes & Source Code
 Last Updated
Size
 
  AN1420
  12/14/2011
  281KB
Silicon Products