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Integrated CAN FD and LIN Devices for Industrial and Automotive Applications

Integrated CAN FD and LIN Devices for Industrial and Automotive Applications


Explore our Controller Area Network (CAN) and Local Interconnect Network (LIN) serial communication devices that enhance your system architecture, lower overall system cost and reduce complexity. Many of our devices are certified to meet the stringent EU automotive Original Equipment Manufacturer (OEM) requirements, which signifies our commitment to performance and reliability. We also provide industrial variants that maintain the same high-speed capabilities, though they are not recommended for automotive use. 

Our portfolio includes functional safety-ready products, with comprehensive documentation to achieve the targeted safely levels (ASIL/SIL) . We also offer devices with Grade 0 temperature ratings for operation in harsh environments. Prioritizing ease of use, our product range includes controllers, transceivers, System-in-Package (SIP) products and optimized System Basis Chips (SBCs).

Featured Products


Industrial Robots

ATA658x Family

CAN/LIN System-Basis Chips (SBCs)

  • CAN FD and LIN transceivers and Low-Dropout (LDO) regulators on a single chip
  • Highly robust, scalable SBC family product is qualified according to AEC-Q100 with temperature Grades 1 and 0
  • Available in variants to suit your requirements

Design Benefits:

  • Smaller footprint
  • Reduced system complexity and size
  • Optional low power consumption
  • ISO 26262 functional safety ready
Car Connectivity

ATA650x Family

CAN SBCs (CAN FD Transceiver with LDO)

  • Compact SBCs integrate CAN FD and an LDO regulator on a single chip
  • Robust, scalable AEC-Q100 temperature Grade 0 qualified
  • Available in variants to suit your requirements

Design Benefits:

  • Smaller footprint
  • Overall system cost reduction
  • Optional low power consumption
  • ISO 26262 functional safety ready
ATSAMHA1617A-B Graphic

ATSAMHAx Family

LIN System-in-Package (SiP) Products

  • Complete System-in-Package (SiP) solution
  • Integrated with 32-bit Arm® Cortex®-M0+ processor, LIN transceivers and Low-Dropout (LDO) regulators
  • Highly robust, scalable SBC family product is qualified according to AEC Q100 qualified with temperature Grade 2 and 3
  • Available in variants to suit your requirements

Design Benefits:

  • Scalable and compact
  • Overall system cost reduction (integrated power conversion)
  • Optional low power consumption
  • ISO 26262 functional safety ready

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