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SY55855V

Status: In Production

Features:

  • Guaranteed fMAX >750MHz over temperature
  • 1.5Gbps throughput capability
  • 3.0V to 5.7V power supply
  • Guaranteed <700ps propagation delay over temperature
  • Guaranteed <50ps within-device skew over temperature
  • LVDS compatible outputs
  • Fully differential I/O architecture
  • Wide operating temperature range: -40°C to +85°C
  • Available in a tiny 10-pin MSOP package
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The SY55855V is a fully differential, CML/PECL/LVPECL-to-LVDS translator. It achieves LVDS signaling up to 1.5Gbps, depending on the distance and the characteristics of the media and noise coupling sources. LVDS is intended to drive 50Ω impedance transmission line media such as PCB traces, backplanes, or cables.SY55855V inputs can be terminated with a single resistor between the true and the complement pins of a given input.The SY55855V is a member of Micrel's new SuperLite™ family of high-speed logic devices. This family features very small packaging, high signal integrity, and operation at many different supply voltages.

Additional Features
    • Guaranteed fMAX >750MHz over temperature
    • 1.5Gbps throughput capability
    • 3.0V to 5.7V power supply
    • Guaranteed <700ps propagation delay over temperature
    • Guaranteed <50ps within-device skew over temperature
    • LVDS compatible outputs
    • Fully differential I/O architecture
    • Wide operating temperature range: -40°C to +85°C
    • Available in a tiny 10-pin MSOP package
Parametrics
Name
Value
Product Type
Logic Translators
Input
PECL/LVPECL/CML
Output
LVDS
Supply Voltage
3.3/6
Max Freq (GHz)
0.75
Max Prop Delay (ps)
700
Icc (mA)
80
Max Within Device Skew (ps)
50
OE
False
RPE
False
FSI
False
Input Mux
False
Input EQ
False
Channels
Dual
Output Type
LVDS
Output Voltage
3.3/5

Documents

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Data Sheets

11/11/2015
76KB

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SY55855VKG
0.024500
0.135600
10
MSOP
3x3x1.0mm
NiPdAu
e4
SY55855VKG-TR
0.024500
0.431180
10
MSOP
3x3x1.0mm
NiPdAu
e4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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