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SST12LP15A

Status: Not Recommended for new designs

Features:

  • High Gain: – Typically 32 dB gain across 2.4–2.5 GHz over temperature 0°C to +85°C
  • High linear output power: – >29 dBm P1dB – Meets 802.11g OFDM ACPR requirement up to 25 dBm – Added EVM~4% up to 23 dBm for 54 Mbps 802.11g signal – Meets 802.11b ACPR requirement up to 25 dBm
  • High power-added efficiency/Low operating current for both 802.11g/b applications – ~26%/300 mA @ POUT = 24 dBm for 802.11g – ~27%/350 mA @ POUT = 25 dBm for 802.11b Applications:
  • WLAN (IEEE 802.11b/g/n)
  • Home RF
  • Cordless phones
  • 2.4 GHz ISM wireless
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST12LP15A is a high-power and high-gain power amplifier based on the highly-reliable InGaP/GaAs HBT technology. Easily configured for high-power applications with superb power-added efficiency while operating over the 2.4-2.5 GHz frequency band, it typically provides 32 dB gain with 26% power-added efficiency @ POUT = 24 dBm for 802.11g and 27% power-added efficiency @ POUT = 25 dBm for 802.11b. The SST12LP15A has excellent linearity while meeting 802.11g spectrum mask at 25 dBm. The power amplifier IC features easy board-level usage along with high-speed power-up/down control and is offered in 16-contact VQFN package.

Please consider this device SST12LP15B

Additional Features
  • High Gain:– Typically 32 dB gain across 2.4–2.5 GHz over temperature 0°C to +85°C
  • High linear output power:– >29 dBm P1dB– Meets 802.11g OFDM ACPR requirement up to 25 dBm– Added EVM~4% up to 23 dBm for 54 Mbps 802.11g signal– Meets 802.11b ACPR requirement up to 25 dBm
  • High power-added efficiency/Low operating current for both 802.11g/b applications– ~26%/300 mA @ POUT = 24 dBm for 802.11g– ~27%/350 mA @ POUT = 25 dBm for 802.11bApplications:
  • WLAN (IEEE 802.11b/g/n)
  • Home RF
  • Cordless phones
  • 2.4 GHz ISM wireless
Parametrics
Name
Value
Type
Power Ampllifier
Gain
32
Linear Power
22
Voltage min
3.0
Voltage max
4.2
Freq min
2.4
Freq max
2.4
Technology
InGaP/GaAs HBT
Application
802.11b/g/n

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST12LP15A-QVCE
0.025300
0.154333
16
VQFN
3x3x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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