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MCP2122

Infrared Encoder/Decoder Compatible with HSDL-7000

Status: In Production

Features:

  • Pinout compatible with HSDL-7000
  • Compliant with IrDA® Standard Physical Layer Specification (version 1.3)
  • UART to IrDA Standard Encoder/Decoder: Interfaces with IrDA Standard Compliant Transceiver
  • Baud Rates: Up to IrDA Standard 115.2 Kbaud Operation
  • Transmit/Receive Formats (Bit Width) Supported: 1.63 µs
  • Low-power Mode (2 µA at 1.8V + 125°C)
  • Pb-free packaging
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

Converts serial data from UART bitstreams to IrDA standard bitstreams (encodes) and from IrDA standard bitstreams to UART bitstreams (decodes). Requires input clock that is 16x needed baud rate.

 

 

 

 

 

Additional Features
    • Pinout compatible with HSDL-7000
    • Compliant with IrDA® Standard Physical Layer Specification (version 1.3)
    • UART to IrDA Standard Encoder/Decoder: Interfaces with IrDA Standard Compliant Transceiver
    • Baud Rates: Up to IrDA Standard 115.2 Kbaud Operation
    • Transmit/Receive Formats (Bit Width) Supported: 1.63 µs
    • Low-power Mode (2 µA at 1.8V + 125°C)
    • Pb-free packaging

     

     

     

Parametrics
Name
Value
Operating Temperature Range (°C)
-40°C to +125°C
Xmit/Rec Formats supported (µS)
1.63
Max. Baud Rate
115200.0
Operating Voltage (V)
1.8 - 5.5
Device Description
Infrared Encoder/Decoder

Documents

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Data Sheet

02/07/2007
776KB

Product Brief

Product Line Card

Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP2122-E/PG
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2122-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122-E/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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