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MCP2122

Infrared Encoder/Decoder Compatible with HSDL-7000

Status: In Production

Features:

  • Pinout compatible with HSDL-7000
  • Compliant with IrDA® Standard Physical Layer Specification (version 1.3)
  • UART to IrDA Standard Encoder/Decoder: Interfaces with IrDA Standard Compliant Transceiver
  • Baud Rates: Up to IrDA Standard 115.2 Kbaud Operation
  • Transmit/Receive Formats (Bit Width) Supported: 1.63 µs
  • Low-power Mode (2 µA at 1.8V + 125°C)
  • Pb-free packaging
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

Converts serial data from UART bitstreams to IrDA standard bitstreams (encodes) and from IrDA standard bitstreams to UART bitstreams (decodes). Requires input clock that is 16x needed baud rate.

 

 

 

 

 

Additional Features
    • Pinout compatible with HSDL-7000
    • Compliant with IrDA® Standard Physical Layer Specification (version 1.3)
    • UART to IrDA Standard Encoder/Decoder: Interfaces with IrDA Standard Compliant Transceiver
    • Baud Rates: Up to IrDA Standard 115.2 Kbaud Operation
    • Transmit/Receive Formats (Bit Width) Supported: 1.63 µs
    • Low-power Mode (2 µA at 1.8V + 125°C)
    • Pb-free packaging

     

     

     

Parametrics
Name
Value
Operating Temperature Range (°C)
-40°C to +125°C
Xmit/Rec Formats supported (µS)
1.63
Max. Baud Rate
115200.0
Operating Voltage (V)
1.8 - 5.5
Device Description
Infrared Encoder/Decoder

Documents

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Data Sheets

MCP2122 Data Sheet
06/23/2015
776KB
MCP2122 IrDA® Encoder/Decoder Product Brief
06/23/2015
83KB

Application Notes

Download All
AN243 - Fundamentals of the Infrared Physical Layer
06/23/2015
307KB
AN888 - Programming the Palm OS™ for Embedded IR Applications
06/23/2015
627KB
AN923 - Using the MCP2120 Developer's Board of "IR Sniffing"
06/23/2015
424KB
AN926 - Programming the Pocket PC OS for Embedded IR Applications
06/24/2015
825KB
AN941 - Programming Windows XP® for Embedded IR Applications
06/24/2015
1342KB
AN946 - Interfacing the MCP2122 to the Host Controller
06/23/2015
623KB

Brochures

Analog & Interface Guide (Volume 2)
06/23/2015
1067KB
Analog & Interface Product Selector Guide
06/06/2019
4519KB
Quick Guide to Microchip Development Tools
07/12/2019
6019KB

User Guides

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide
06/23/2015
1367KB
MCP2120/22 Developer's Board User's Guide
06/23/2015
1398KB
MCP212X Developer's Daughter Board User's Guide
06/23/2015
2034KB

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP2122-E/PG
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
MCP2122-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122-E/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP2122-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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